POWER MODULE FOR MULTI-CHIP PRINTED CIRCUIT BOARDS

• US 20040150954A1
• Filed: 01/31/2003
• Published: 08/05/2004
• Est. Priority Date: 01/31/2003
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Harris, Shaun L., Belady, Christian L., Boudreaux, Brent A., Williams, Gary Wayne
• Granted Patent: US 6,771,507 B1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence

Abstract

A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.

Claims

1. A power module assembly, comprising:

a heat distribution plate having at least first and second fields of receptacles integrally formed therein and populated with first and second fields of thermally-conductive pins, respectively, the pins capable of moving independently in a direction orthogonal to the plate responsive to forces applied to them; and

a power module printed circuit board mounted to the heat distribution plate and having first and second clearance holes formed therein;

wherein the first and second fields of pins protrude through the first and second clearance holes.

2. The power module assembly of claim 1, further comprising:

a multi-chip printed circuit board mounted adjacent to the power module printed circuit board and having first and second heat generating chips mounted thereon;

wherein a surface of the first heat generating chip contacts the first field of pins, and a surface of the second heat generating chip contacts the second field of pins.

3. The power module assembly of claim 1, wherein:

the first and second fields of receptacles are disposed on first and second bosses, respectively, the bosses integrally formed on the heat distribution plate.

4. The power module assembly of claim 3, wherein:

the first and second bosses protrude through the first and second clearance holes.

5. The power module assembly of claim 2, further comprising:

a first power connector component mounted to the power module printed circuit board; and

a second power connector component mounted to the multi-chip printed circuit board;

wherein the first and second power connector components mate.

6. The power module assembly of claim 5, wherein:

the first and second power connector components comprise a blade-style connector assembly.

7. The power module assembly of claim 5, wherein:

the first and second power connector components are oriented orthogonal to the heat distribution plate; and

the planes of the power module circuit board and the multi-chip circuit board are oriented parallel to the heat distribution plate.