Method for integrated high Q inductors in FCGBA packages
First Claim
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1. An inductor assembly, comprising:
- a flip-chip, ball-grid array package substrate; and
an on-package, off-die trace line coupled to one or more bumps attached to an upper surface of a package substrate, wherein the trace line has an inherent self-inductance.
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Abstract
A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance and a predetermined length. The quality factor associated with the inductor is a ratio of the trace line'"'"'s inductance to the trace lines resistance. The package substrate is a low loss laminate.
19 Citations
30 Claims
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1. An inductor assembly, comprising:
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a flip-chip, ball-grid array package substrate; and
an on-package, off-die trace line coupled to one or more bumps attached to an upper surface of a package substrate, wherein the trace line has an inherent self-inductance. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A wireless communications device, comprising:
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a package substrate;
a plurality of bumps disposed on an upper surface of the package substrate;
a microelectronic die coupled to the plurality of bumps; and
an on-laminate, off-die trace line having an inherent self-inductance;
the trace line coupled to one or more of the plurality of bumps. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A computer, comprising:
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a bus;
a processor coupled to the bus;
memory device coupled to the bus to store computer readable instructions to be executed by the processor;
a wireless transceiver coupled to the bus to transmit and receive data over a predetermined radio frequency; and
a semiconductor package associated with the bus, the package including;
a package substrate;
a microelectronic die connected to the substrate; and
an on-substrate, off-die trace line formed on the upper surface of the package substrate, the trace line having an inherent self-inductance being coupled to one or more of a plurality of bumps attached to the upper surface of the substrate. - View Dependent Claims (26, 27, 28, 29, 30)
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Specification