Ball grid array package with an electromagnetic shield connected directly to a printed circuit board

• US 20040150977A1
• Filed: 01/20/2004
• Published: 08/05/2004
• Est. Priority Date: 01/20/2003
• Status: Active Grant

• Current Assignee: BenQ Corporation (Qisda Corporation)
• Original Assignee: BenQ Corporation (Qisda Corporation)
• Inventors: Hsieh, Chia-Ming
• Granted Patent: US 6,947,295 B2
• Time in Patent Office: Days
• US Class Current: 361/818
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A ball grid array package includes a chip having a substrate with a bottom surface, a plurality of solder bumps projecting outwardly from the bottom surface of the substrate, and an electromagnetic shield including a housing that defines an inner space which receives the chip and the solder bumps therein, and a bottom opening for access into the inner space. The solder bumps project outwardly of the inner space through the bottom opening in the housing.

Claims

1. A ball grid array package comprising:

a chip including a substrate with a bottom surface;

a plurality of solder bumps projecting outwardly from said bottom surface of said substrate; and

an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space;

wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing.

2. The ball grid array package of claim 1, wherein said housing of said electromagnetic shield is connected directly to said substrate of said chip.

3. The ball grid array package of claim 2, wherein said housing of said electromagnetic shield has a peripheral wall that surrounds said chip and said solder bumps.

4. The ball grid array package of claim 3, wherein said peripheral wall is formed with at least one side opening, said substrate having a corresponding tab projecting outwardly therefrom and extending transversely of said peripheral wall through said side opening.

5. The ball grid array package of claim 4, wherein said peripheral wall has a bottom end, said side opening extending to said bottom end.

6. The ball grid array package of claim 3, wherein said peripheral wall has a bottom end, two first recesses extending to said bottom end, and two vertical slits disposed between said first recesses to form a flexible part therebetween.

7. The ball grid array package of claim 6, wherein said flexible part is formed with a stop that projects into said inner space in said housing, said substrate being supported on said stop.

8. An electronic device comprising:

a printed circuit board;

a chip including a substrate with opposite top and bottom surfaces, and a semiconductor die mounted on said top surface of said substrate;

a plurality of solder bumps projecting outwardly from said bottom surface of said substrate and connected directly and electrically to said printed circuit board; and

an electromagnetic shield including a housing that defines an inner space which receives said chip and said solder bumps therein, and a bottom opening for access into said inner space, said housing having a bottom end that defines said bottom opening and that is connected directly to said printed circuit board;

wherein said solder bumps project outwardly of said inner space through said bottom opening in said housing.

9. The electronic device of claim 8, wherein said housing of said electromagnetic shield is connected directly to said substrate of said chip.