Polyvinyl acetal composition skinless roller brush

• US 20040151890A1
• Filed: 12/31/2003
• Published: 08/05/2004
• Est. Priority Date: 04/20/2001
• Status: Abandoned Application

• Current Assignee: Tolland Development Company, LLC
• Original Assignee: Tolland Development Company, LLC
• Inventors: Drury, Thomas J.
• Application Number:
  US10/748,302
• Publication Number:
  US 20040151890A1
• Time in Patent Office: Days
• US Class Current: 428/304.4
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: Y10T 428/249953 Composite having voids in a component [e.g., porous, cellular, etc.]
• CPC Class Codes: Y10T 428/249972 Resin or rubber element
• CPC Class Codes: Y10T 428/249978 Voids specified as micro
• CPC Class Codes: Y10T 428/249989 Integrally formed skin

Abstract

A semiconductor cleaning device having a substantially cylindrical roller body made of polyvinyl acetal with a smooth outer surface and uniform material porosity having a mean flow pore pressure ranging from about 0.30 PSI to about 0.35 PSI with 95% of its pores ranging from 7 to 40 microns in size and a wet flow rate ranging from about 80.0 L/min to about 7.0 L/min.

Claims

1. A cleaning device comprising a body made of porous polyvinyl acetal material having a uniform pore size throughout the material with over 90% of the pores ranging from about 7 microns to about 40 microns in diameter.

2. A cleaning device as claimed in claim 1 wherein said device is a roller having a smooth outer surface.

3. A cleaning device as claimed in claim 1 wherein said device is a pad.

4. A cleaning device as claimed in claim 1 wherein said device is a disk.

5. A cleaning device as claimed in claim 1 wherein said polyvinyl acetal material has an average pore size of about 20 microns.

6. A cleaning device as claimed in claim 1 wherein said material has about 95% of its pores with a diameter below 40 microns.

8. A cleaning device as claimed in claim 2 wherein said roller has an outside diameter of about 60mm and an inside diameter of about 30mm with a thickness of about 15 mm.

9. A cleaning device as claimed in claim 1 wherein said material has a mean flow pore pressure of about 0.33 PSI.

7. A cleaning device comprising a body made of porous polyvinyl acetal material having a bubble point pressure of about, 0.92 PSI.

10. A semiconductor cleaning device comprising a body made of porous polyvinyl acetal material with a cylindrical roller shape and a smooth outer surface, said material having a uniform pore size throughout with at least 90% of the pores ranging from about 7 microns to about 40 microns in diameter with a fluid flow through rate which does not distort the roller during the cleaning process.

11. A semiconductor cleaning device as claimed in claim 10 wherein said polyvinyl acetal material has an average pore size of about 20 microns.

12. A semiconductor cleaning device as claimed in claim 10 wherein said material has 95% of its pores with a diameter below 40 microns.

14. A semiconductor cleaning device as claimed in claim 10 wherein said roller is substantially skinless.

15. A semiconductor cleaning device as claimed in claim 10 wherein said material has a mean flow pore pressure of about 0.33 PSI.

13. A semiconductor cleaning device comprising a body made of porous polyvinyl acetal material having at least 95% of its pores with a diameter under 40 microns.

16. A semiconductor cleaning device comprising a body made of porous polyvinyl acetal material having a uniform pore size throughout the material with at least 95% of the pores being less than 40 microns in diameter, said material having a mean flow pore diameter of about 20 microns.

17. A semiconductor cleaning device as claimed in claim 16 wherein said material has a mean flow-pressure of about 0.33 PSI.

18. A semiconductor cleaning device comprising a substantially cylindrical roller body made of polyvinyl acetal with a smooth outer surface and uniform material porosity having a mean flow pore pressure ranging from about 0.30 PSI to about 0.40 PSI with 90% of its pores ranging from 7 to 40 microns and wet flow rate using water as a medium ranging from about 9.0 L/min to 20.0 L/min

19. A semiconductor cleaning device as claimed in claim 18 wherein cleaning solvent flow through said roller ranges from 120-180 ml/minute.