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Manufacturing methods and vacuum or hermetically packaged micromachined or MEMS devices formed thereby having substantially vertical feedthroughs

  • US 20040152229A1
  • Filed: 10/17/2003
  • Published: 08/05/2004
  • Est. Priority Date: 10/18/2002
  • Status: Active Grant
First Claim
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1. A method for manufacturing a vacuum or hermetically packaged micromachined or MEMS device having at least one substantially vertical feedthrough, the method comprising:

  • providing a micromachined or MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity;

    forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and

    forming a path of electrically conductive material connecting the micromachined or MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.

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