Modeling an abrasive process to achieve controlled material removal
First Claim
1. A method comprising:
- generating an open-loop model of a cut rate of an abrasive article type when applied to workpiece type over an abrading period; and
abrading a workpiece of the workpiece type with an abrasive article of the abrasive article type in accordance with the model to achieve a substantially constant cut rate.
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Accused Products
Abstract
In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of feedback controls within the abrasive manufacturing process. For example, a system includes a machine to abrade a workpiece with an abrasive article, and a controller to control the application of the abrasive article to the workpiece by the machine to achieve a substantially constant cut rate for the abrasive article. The controller controls one or more process variables in accordance with an open-loop mathematical model that relates the cut rate of the abrasive article to an application force of the abrasive article to achieve controlled material removal. For example, a constant rate of cut can be achieved or a fixed amount of material can be removed while abrading one or more workpiece in accordance with the model.
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Citations
70 Claims
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1. A method comprising:
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generating an open-loop model of a cut rate of an abrasive article type when applied to workpiece type over an abrading period; and
abrading a workpiece of the workpiece type with an abrasive article of the abrasive article type in accordance with the model to achieve a substantially constant cut rate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 43, 44)
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22. A system comprising:
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a machine to abrade a workpiece with an abrasive article; and
a controller to control the application of the abrasive article to the workpiece by the machine in accordance with an open-loop model to achieve a substantially constant cut rate for the abrasive article. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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- 45. A computer-readable medium comprising instructions to cause a programmable controller to direct a machine to abrade a workpiece with an abrasive article in accordance with an open-loop model to achieve a substantially constant cut rate for the abrasive article over an abrading period.
- 52. A computer-readable medium comprising data representing an open-loop model for use by a machine to abrade a workpiece with an abrasive article to achieve a substantially constant cut rate for the abrasive article over an abrading period.
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58. A method comprising:
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generating an open-loop model of a cut rate of an abrasive article type when applied to a workpiece type over an abrading period; and
abrading a workpiece of the workpiece type with an abrasive article of the abrasive article type in accordance with the model to achieve a controlled amount of material removed from the workpiece during the abrading period. - View Dependent Claims (59, 60)
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61. A method comprising:
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generating an open-loop model of a cut rate of an abrasive article type when applied to workpiece type over an abrading period; and
abrading a plurality of workpieces of the workpiece type with an abrasive article of the abrasive article type for varying time periods in accordance with the model to remove a constant amount of material from each workpiece. - View Dependent Claims (62)
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63. A method comprising:
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collecting abrasive performance data for a type an abrasive article when applied to a type of workpiece;
generating an open-loop model of a performance parameter as a function of a process control parameter based on the collected abrasive performance data; and
abrading one or more workpieces of the workpiece type with one or more abrasive articles of the abrasive article type in accordance with the model to achieve a desired abrasive performance. - View Dependent Claims (64, 65, 66, 67)
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68. A method comprising:
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generating an open-loop model of a performance parameter of a type abrasive article type when applied to a type of semiconductor conditioning pad;
polishing a plurality of semiconductor wafers with a conditioning pad of the conditioning pad type; and
repeatedly abrading the conditioning pad with an abrasive article of the abrasive article type in accordance with the model to remove a substantially equal amount of material from the pad during each of the abradings. - View Dependent Claims (69, 70)
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Specification