Integrated circuit package separators

• US 20040154451A1
• Filed: 02/05/2004
• Published: 08/12/2004
• Est. Priority Date: 10/20/1998
• Status: Active Grant

• Current Assignee: Jason E. Tripard
• Original Assignee: Jason E. Tripard
• Inventors: Tripard, Jason E.
• Granted Patent: US 6,920,815 B2
• Time in Patent Office: Days
• US Class Current: 83/651
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2203/0165 Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10S 83/953 with work support
• CPC Class Codes: Y10T 83/748 With work immobilizer
• CPC Class Codes: Y10T 83/7593 Work-stop abutment
• CPC Class Codes: Y10T 83/7633 Collapsible
• CPC Class Codes: Y10T 83/929 Tool or tool with support
• CPC Class Codes: Y10T 83/9372 Rotatable type

Abstract

An integrated circuit package separator for separating integrated circuit packages from a board includes a base, a support over the base, and a pair of pneumatic actuators including first and second lift members laterally spaced from the base and beneath respective ends of a pair of opposing ends of the support. The first and second lift members are configured to vertically displace the support and lift the support off the base by contacting the support. Individual actuators of the pair include release valves configured to equilibrate a back-pressure of the individual actuators to ambient during lifting of the support. The separator includes a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.

Claims

1. An integrated circuit package separator for separating integrated circuit packages from a board, the separator comprising:

a base;

a support over the base;

a pair of pneumatic actuators including first and second lift members laterally spaced from the base and beneath respective ends of a pair of opposing ends of the support, the first and second lift members being configured to vertically displace the support and lift the support off the base by contacting the support, each of the pneumatic actuators including release valves configured to equilibrate a back-pressure of each of the pneumatic actuators to ambient during lifting of the support; and

a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.

2. The separator of claim 1, wherein the base comprises a plurality of pins extending upwardly from the base.

3. The separator of claim 2, wherein the support comprises an upper surface and a plurality of holes extending therethrough, the plurality of pins being configured to extend through respective ones of the plurality of holes and upwardly beyond the upper surface of the support.

4. The separator of claim 3, wherein the support and the plurality of pins being configured such that the plurality of pins extend into the plurality of holes in the board when the board is placed over the upper surface of the support.

5. The separator of claim 3, wherein the plurality of pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least one pin.

6. The separator of claim 1, wherein the base includes a substantially planar upper surface, and the first and second lift members each have a substantially planar upper surface, the planar surfaces of the first and second lift members being substantially flush with the planar upper surface of the base.

7. An integrated circuit package separator, comprising:

a base;

a support over the base;

a pair of pneumatic actuators configured to vertically displace the support and lift the support off the base;

each actuator of the pair of pneumatic actuators including release valves configured to equilibrate a back-pressure of each actuator to ambient during lifting of the support such that the actuators lift respective opposing ends of the support substantially simultaneously and in unison; and

a cutting mechanism configured to cut a board, having integrated circuit packages, while the board is over an upper surface of the support to separate the integrated circuit packages from one another.

8. The separator of claim 7, wherein the base comprises a plurality of pins extending upwardly from the base.

9. The separator of claim 8, wherein the support comprises a plurality of holes extending therethrough, the plurality of pins being configured to extend through respective ones of the plurality of holes and upwardly beyond the upper surface of the support.

10. The separator of claim 9, wherein the support and the plurality of pins being configured such that the plurality of pins extend into the plurality of holes in the board when the board is placed over the upper surface of the support.

11. The separator of claim 9, wherein the plurality of pins align with the board such that each of the separated integrated circuit packages is retained to the support by at least one pin.

12. The separator of claim 7, wherein the base and each of the actuators have a substantially planar upper surface, the planar surfaces of the actuators being substantially flush with the planar upper surface of the base.