Method for removing patterned layer from lower layer through reflow
First Claim
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1. A method for removing an organic compound layer from a lower layer, comprising the steps of:
- a) carrying out a preliminary treatment on said organic compound layer so as to deform said organic compound layer or change-quality of the organic compound; and
b) peeling said organic compound layer from said lower layer.
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Abstract
A photo-resist mask of organic compound is stripped off after the pattern transfer to a layer thereunder, wherein the photo-resist mask is firstly exposed to vapor of organic solvent for reducing the thickness through a reflow, and, thereafter, the photo-resist mask is ashed in an oxygen plasma, whereby the dry ashing is completed within a short time period by virtue of the reduction of thickness.
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Citations
16 Claims
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1. A method for removing an organic compound layer from a lower layer, comprising the steps of:
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a) carrying out a preliminary treatment on said organic compound layer so as to deform said organic compound layer or change-quality of the organic compound; and
b) peeling said organic compound layer from said lower layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification