Integrated circuit package separator methods
First Claim
1. An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits, comprising:
- providing a base having a plurality of pins extending upwardly therefrom;
providing a support over the base, the support having a plurality of holes extending therethrough, the pins extending through the plurality of holes formed in the board and upwardly beyond an upper surface of the support;
configuring the support and the base such that the plurality of pins extend into the holes in the board when the board is placed over the upper surface of the support;
vertically displacing the support off the pins using a pair of pneumatic actuators such that individual actuators of the pair lift respective opposing ends of the support substantially simultaneously and in unison;
providing each actuator of the pair with release valves to equilibrate a back-pressure to ambient during lifting of the support; and
separating the integrated circuit packages from one another when the board is over the upper surface of the support.
0 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits. The method includes providing a base having a plurality of pins, providing a support over the base and having a plurality of holes extending therethrough, the plurality of pins extending through the plurality of holes, vertically displacing the support off the pins using a pair of pneumatic actuators such that each of the pneumatic actuators lift respective opposing ends of the support substantially simultaneously and in unison, providing each of the pneumatic actuators with release valves to equilibrate a back-pressure to ambient during lifting of the support, and separating the integrated circuit packages from one another when the board is over the upper surface of the support.
-
Citations
10 Claims
-
1. An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits, comprising:
-
providing a base having a plurality of pins extending upwardly therefrom;
providing a support over the base, the support having a plurality of holes extending therethrough, the pins extending through the plurality of holes formed in the board and upwardly beyond an upper surface of the support;
configuring the support and the base such that the plurality of pins extend into the holes in the board when the board is placed over the upper surface of the support;
vertically displacing the support off the pins using a pair of pneumatic actuators such that individual actuators of the pair lift respective opposing ends of the support substantially simultaneously and in unison;
providing each actuator of the pair with release valves to equilibrate a back-pressure to ambient during lifting of the support; and
separating the integrated circuit packages from one another when the board is over the upper surface of the support. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. An integrated circuit package separator method for separating integrated circuit packages from a board having a plurality of integrated circuits, the method comprising:
-
providing a base having a plurality of pins;
providing a support over the base and having a plurality of holes extending therethrough, the plurality of pins extending through the plurality of holes;
vertically displacing the support off the pins using a pair of pneumatic actuators such that each of the pneumatic actuators lift respective opposing ends of the support substantially simultaneously and in unison;
providing each of the pneumatic actuators with release valves to equilibrate a back-pressure to ambient during lifting of the support; and
separating the integrated circuit packages from one another when the board is over the upper surface of the support. - View Dependent Claims (9, 10)
-
Specification