Resin for the encapsulation of photosemiconductor element, photosemiconductor device comprising encapsulated optical semiconductor element, and process for producing the device

• US 20040157992A1
• Filed: 02/02/2004
• Published: 08/12/2004
• Est. Priority Date: 02/04/2003
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Hotta, Yuji, Uwada, Kazuki, Sadayori, Naoki
• Application Number:
  US10/768,674
• Publication Number:
  US 20040157992A1
• Time in Patent Office: Days
• US Class Current: 525/69
• CPC Class Codes: C08G 18/797 containing carbodiimide and/or uretone-imine groups
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide having a specific structure; a photosemiconductor device including a photosemiconductor element encapsulated with the resin; and a process for producing the photosemiconductor device which includes the steps of placing the resin on a photosemiconductor element and heating the resin. The resin enables the photosemiconductor element to maintain high brightness when it is a light-emitting element and to maintain high photodetection sensitivity when it is a photodetector, and also enables the photosemiconductor element to be easily encapsulated.

Claims

1. A resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide represented by the following formula (1):

R¹—

N═

C═

N—

(—

R—

N═

C═

N—

)_n—

R¹ 

 

(1)

wherein R represents a diisocyanate residue, R¹ represents a monoisocyanate residue, and n is an integer of 1-100.

2. The resin as claimed in claim 1, wherein 10 mol % or more of the diisocyanate residues are aromatic diisocyanate residues.

3. The resin as claimed in claim 1, wherein the diisocyanate residues are residues of at least one member selected from the group consisting of tolylene diisocyanate, 4,4′

-diphenylmethane diisocyanate, and naphthalene diisocyanate.

4. The resin as claimed in claim 1, wherein the monoisocyanate residues are aromatic monoisocyanate residues.

5. The resin as claimed in claim 4, wherein the aromatic monoisocyanate residues are residues of 1-naphthyl isocyanate.

6. The resin as claimed in claim 1, which is in a sheet form.

7. A photosemiconductor device comprising a photosemiconductor element encapsulated with a resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide represented by the following formula (1):

R¹—

N═

C═

N—

(—

R—

N═

C═

N—

)_n—

R¹ 

 

(1)

wherein R represents a diisocyanate residue, R¹ represents a monoisocyanate residue, and n is an integer of 1-100.

8. The photosemiconductor device as claimed in claim 7, wherein the resin is in a sheet form.

9. A process for producing a photosemiconductor device which comprises the steps of placing a resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide represented by the following formula (1):

R¹—

N═

C═

N—

(—

R—

N═

C═

N—

)_n—

R¹ 

 

(1)

wherein R represents a diisocyanate residue, R¹ represents a monoisocyanate residue, and n is an integer of 1-100 on a photosemiconductor element and heating the resin or resin sheet.

10. The process as claimed in claim 9, wherein the resin is in a sheet form.