Flexible dielectric electronic substrate and method for making same
First Claim
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1. A molecularly flexible dielectric electronic substrate comprising:
- at least one layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C.;
a metal foil on one surface of said layer of molecularly flexible dielectric adhesive, wherein said metal foil is patterned to define a pattern of electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device.
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Abstract
A molecularly flexible dielectric electronic substrate for receiving an electronic device includes a sheet or layer of a molecularly flexible dielectric adhesive having patterned metal foil electrical conductors thereon.
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Citations
20 Claims
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1. A molecularly flexible dielectric electronic substrate comprising:
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at least one layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C.;
a metal foil on one surface of said layer of molecularly flexible dielectric adhesive, wherein said metal foil is patterned to define a pattern of electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device.
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2. The molecularly flexible dielectric electronic substrate of claim 1 wherein said plurality of contact sites are in a pattern corresponding to a pattern of contacts of an electronic device.
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3. The molecularly flexible dielectric electronic substrate of claim 1 further comprising an electronic device having a plurality of contacts soldered to corresponding contacts sites of the patterned metal foil on said molecularly flexible dielectric adhesive layer.
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4. The molecularly flexible dielectric electronic substrate of claim 3 further comprising a protective enclosure surrounding said electronic device and attached at least along its periphery to said molecularly flexible dielectric adhesive layer.
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5. The molecularly flexible dielectric electronic substrate of claim 3 further comprising an underfill adhesive bonding said electronic device and said molecularly flexible dielectric adhesive layer.
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6. The molecularly flexible dielectric electronic substrate of claim 5 wherein said underfill adhesive includes molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi.
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7. The molecularly flexible dielectric electronic substrate of claim 1 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi.
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8. The molecularly flexible dielectric electronic substrate of claim 1 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi.
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9. A molecularly flexible dielectric electronic substrate comprising:
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a first layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C.;
a first metal foil on a first exposed surface of said first layer of molecularly flexible dielectric adhesive, wherein said first metal foil is patterned to define a pattern of first electrical conductors having a plurality of contact sites for receiving the contacts of an electronic device;
a second metal foil on a second exposed surface of said first layer of molecularly flexible dielectric adhesive opposing the first surface thereof, wherein said metal foil is patterned to define a pattern of second electrical conductors; and
a plurality of electrically conductive vias through said first layer of molecularly flexible dielectric adhesive, said plurality of electrically conductive vias being in a pattern for providing electrical connection between ones of said first electrical conductors and ones of said second electrical conductors.
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10. The molecularly flexible dielectric electronic substrate of claim 9 further comprising:
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a second layer of molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C., wherein said second layer of molecularly flexible dielectric adhesive adheres to the second surface of said first layer of molecularly flexible dielectric adhesive with said patterned second metal foil therebetween;
a third metal foil on an exposed surface of said second layer of molecularly flexible dielectric adhesive, wherein said third metal foil is patterned to define a pattern of third electrical conductors; and
a plurality of second electrically conductive vias through said second layer of molecularly flexible dielectric adhesive, said plurality of second electrically conductive vias being in a pattern for providing electrical connection between ones of said second electrical conductors and ones of said third electrical conductors.
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11. The molecularly flexible dielectric electronic substrate of claim 10 wherein said conductive vias are built up of plated metal.
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12. The molecularly flexible dielectric electronic substrate of claim 10 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi.
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13. The molecularly flexible dielectric electronic substrate of claim 10 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi.
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14. The molecularly flexible dielectric electronic substrate of claim 9 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 100,000 psi.
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15. The molecularly flexible dielectric electronic substrate of claim 9 wherein said molecularly flexible dielectric adhesive has a modulus of elasticity less than about 20,000 psi.
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16. The molecularly flexible dielectric electronic substrate of claim 9 in combination with at least one electronic device having a plurality of contacts thereon connected to at least certain ones of the contact sites of said first electrical conductors.
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17. A method for making a molecularly flexible electronic substrate for receiving an electronic device comprising:
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providing a sheet of metal foil;
providing on one surface of the sheet of metal foil at least one layer of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C., the layer of molecularly flexible dielectric adhesive having a plurality of via openings therein;
building up conductive material on the metal foil to fill the via openings, thereby forming conductive vias therein;
patterning the metal foil to form a pattern of contacts and conductors electrically connected to the conductive vias in the molecularly flexible dielectric adhesive layer; and
plating at least one of the conductive vias and the contacts of the patterned metal foil to provide external contacts.
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18. The method of claim 17 further comprising:
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providing a second metal foil on a second surface of the at least one layer of molecularly flexible dielectric adhesive opposing the first surface thereof, wherein the second metal foil electrically connects to the conductive vias in the at least one molecularly flexible dielectric adhesive layer; and
patterning the second metal foil to form a pattern of contacts and conductors electrically connected to the conductive vias in the at least one molecularly flexible dielectric adhesive layer.
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19. The method of claim 17 further comprising:
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after said patterning the metal foil, providing on the surface of the electrical conductors of the patterned sheet of metal foil not having the at least one layer of molecularly flexible dielectric adhesive thereon at least a second layer of a molecularly flexible dielectric adhesive having a modulus of elasticity less than about 500,000 psi, having a glass transition temperature less than about 0°
C., and having the ability to withstand soldering at a temperature of about 220°
C., the at least second layer of molecularly flexible dielectric adhesive having a plurality of via openings therein; and
building up conductive material on the metal foil to fill the via openings in the at least second layer of molecularly flexible dielectric adhesive, thereby forming conductive vias therein.
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20. The method of claim 17 further comprising electrically connecting contacts of at least one electronic device to corresponding ones of the conductive vias.
Specification