Semiconductor device
First Claim
1. A semiconductor device comprising:
- a first electrode placed in a periphery of a semiconductor chip, for connection to an on-chip antenna and an external antenna;
a second electrode placed in a periphery of the semiconductor chip, for connection to an external antenna;
an on-chip antenna connection electrode placed in an inner area of the semiconductor chip compared to the first electrode and the second electrode; and
a circuit formed in the semiconductor chip, wherein the first electrode and the second electrode are connected to the circuit by internal lines, and the on-chip antenna connection electrode is connected to the circuit and the first electrode by internal lines.
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Accused Products
Abstract
A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connection electrodes, and an internal circuit formed in the semiconductor chip. The first and second antenna connection electrodes are connected to the internal circuit by internal lines. The on-chip antenna connection electrode is connected to the internal circuit and the second antenna connection electrode by internal lines. An on-chip antenna is connected to the second antenna connection electrode and the on-chip antenna connection electrode. An external antenna is connected to the first and second antenna connection electrodes.
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Citations
15 Claims
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1. A semiconductor device comprising:
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a first electrode placed in a periphery of a semiconductor chip, for connection to an on-chip antenna and an external antenna;
a second electrode placed in a periphery of the semiconductor chip, for connection to an external antenna;
an on-chip antenna connection electrode placed in an inner area of the semiconductor chip compared to the first electrode and the second electrode; and
a circuit formed in the semiconductor chip, wherein the first electrode and the second electrode are connected to the circuit by internal lines, and the on-chip antenna connection electrode is connected to the circuit and the first electrode by internal lines. - View Dependent Claims (2, 6, 10, 14, 15)
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3. A semiconductor device comprising:
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a first electrode placed in a periphery of a semiconductor chip, for connection to an on-chip antenna and an external antenna;
a second electrode placed in a periphery of the semiconductor chip, for connection to an external antenna;
an on-chip antenna connection electrode placed in an inner area of the semiconductor chip compared to the first electrode and the second electrode; and
a circuit formed in the semiconductor chip, wherein the first electrode and the second electrode are connected to the circuit by internal lines, the on-chip antenna connection electrode is connected to the circuit and the first electrode by internal lines, and the on-chip antenna connection electrode and the first electrode are connected to an on-chip antenna formed thereabove with an insulating layer interposed therebetween. - View Dependent Claims (7, 11)
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4. A semiconductor device comprising:
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a first electrode placed in a periphery of a semiconductor chip;
a second electrode placed in a periphery of the semiconductor chip;
an on-chip antenna connection electrode placed in an inner area of the semiconductor chip compared to the first electrode and the second electrode;
a circuit formed in the semiconductor chip; and
an external antenna connected to the first electrode and the second electrode, wherein the first electrode and the second electrode are connected to the circuit by internal lines, and the on-chip antenna connection electrode is connected to the circuit and the first electrode by internal lines. - View Dependent Claims (8, 12)
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5. A semiconductor device comprising:
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an external antenna connection electrode placed in a periphery of a semiconductor chip;
an on-chip antenna connection electrode placed in an inner area of the semiconductor chip compared to the external antenna connection electrode; and
a circuit formed in the semiconductor chip, wherein the external antenna connection electrode is connected to the circuit by an internal line, and the on-chip antenna connection electrode is connected to the circuit and the external antenna connection electrode by internal lines. - View Dependent Claims (9, 13)
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Specification