Digital micromirror device having mirror-attached spring tips
First Claim
1. An array of digital micro pixel elements, comprising:
- a mirror layer having a mirror associated with each pixel element;
a hinge layer spaced under the mirror layer, the hinge layer having a torsion hinge under each mirror and attached to the mirror such that the mirror may tilt above the hinge layer; and
an address layer spaced under the hinge layer, the address layer having circuitry for controlling operation of the pixel elements;
wherein the hinge layer further has spring tips under each mirror and mechanically connected to and moveable with the mirror.
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Abstract
A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. Spring tips 13c under the mirror 14a are attached to the underside of the mirror 14a. These spring tips 13c tilt with the mirror 14a and provide a landing point for the mirror 14a onto a surface of the underlying pixel element structure.
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Citations
21 Claims
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1. An array of digital micro pixel elements, comprising:
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a mirror layer having a mirror associated with each pixel element;
a hinge layer spaced under the mirror layer, the hinge layer having a torsion hinge under each mirror and attached to the mirror such that the mirror may tilt above the hinge layer; and
an address layer spaced under the hinge layer, the address layer having circuitry for controlling operation of the pixel elements;
wherein the hinge layer further has spring tips under each mirror and mechanically connected to and moveable with the mirror. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A micro pixel array, comprising:
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a substrate having electrical components fabricated on the surface of the substrate;
an array of pixel elements, each element comprising a mirror, a hinge under the mirror spaced under the mirror by an air gap and mechanically connected to the mirror such that the mirror may tilt above the hinge, an address layer spaced under the hinge and in electrical connection with the electrical components of the substrate, and spring tips mechanically connected to the underside of the mirror, such that the spring tips may move with the mirror and provide landing points for the mirror. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of forming a micro pixel array, comprising the steps of:
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forming control circuitry on a semiconductor substrate;
depositing a first spacer layer on the substrate;
patterning the first spacer layer to define hinge support vias and spring tip support vias;
depositing a hinge layer over the first spacer layer;
forming at least one hinge etch mask on the hinge layer;
patterning the hinge layer to form at least one hinge and at least two spring tips;
depositing a second spacer layer over the hinge layer;
patterning the second spacer layer to define mirror support vias;
depositing a metal mirror layer over the second spacer layer;
patterning the metal mirror layer to form an array of micromirrors; and
removing the first and the second spacer layers. - View Dependent Claims (16, 17, 18)
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19. A display system, comprising:
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a light source for producing a light beam along a light path; and
a micromirror device in the light path for selectively reflecting portions of the light beam along a second light path toward an image plane, the micromirror device comprising;
a substrate having electrical components fabricated on the surface of the substrate;
an array of mirror elements, each element comprising a reflective mirror, a hinge under the mirror spaced under the mirror by an air gap and mechanically connected to the mirror such that the mirror may tilt above the hinge, an address layer spaced under the hinge and in electrical connection with the electrical components of the substrate, and spring tips mechanically connected to the underside of the mirror such that the spring tips move with the mirror and provide a landing surface for the mirror. - View Dependent Claims (20, 21)
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Specification