Cover apparatus for dissipating heat and shielding electromagnetic interference
First Claim
1. A cover apparatus for a plug-in interface card that contains at least one circuit board with at least one chip, the cover apparatus comprising:
- a plate installed on the circuit board to cover the chip and with at least one concave directly or indirectly contacting with a surface of the chip for heat dissipation; and
at least one fastener installed around the chip on the circuit board to secure the plate onto the circuit board and enhancing the heat dissipation from the chip.
1 Assignment
0 Petitions
Accused Products
Abstract
A cover apparatus for a plug-in interface card is provided. The cover apparatus comprises a plate, which secures on a circuit board of a wireless local area network (WLAN) card. The plate has at least one concave corresponding to a chip on the WLAN card. The concave directly or indirectly contacts the chip to dissipate heat. The cover apparatus also comprises a fastener installed near the chip to fix the plate on the circuit board. By the concave and thefastener, the plate is able to not only shield electromagnetic interference (EMI) but also dissipate heat from the chip.
17 Citations
16 Claims
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1. A cover apparatus for a plug-in interface card that contains at least one circuit board with at least one chip, the cover apparatus comprising:
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a plate installed on the circuit board to cover the chip and with at least one concave directly or indirectly contacting with a surface of the chip for heat dissipation; and
at least one fastener installed around the chip on the circuit board to secure the plate onto the circuit board and enhancing the heat dissipation from the chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A cover apparatus for a plug-in interface card that contains at least one circuit board with at least one chip, the cover apparatus comprising:
a plate installed on the circuit board to cover the chip and with at least one concave directly or indirectly contacting with a surface of the chip for heat dissipation;
at least one engaging mechanism for securing the plate onto the circuit board;
at least one sidewall extending a predetermined distance from a fringe of the plate toward the chip by substantially 90 degrees;
at least one fastener installed around the chip on the circuit board to secure the plate onto the circuit board and enhancing the heat dissipation from the chip; and
at least one fencingdisposed on the circuit board for attaching to the sidewall and securing the plate onto the circuit board. - View Dependent Claims (11, 12, 13, 14, 15, 16)
Specification