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Thin film integrated circuit device IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container

  • US 20040164302A1
  • Filed: 02/20/2004
  • Published: 08/26/2004
  • Est. Priority Date: 02/24/2003
  • Status: Active Grant
First Claim
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1. A thin film integrated circuit device comprising:

  • an insulating film;

    a plurality of semiconductor films isolated from one another, which are provided over one surface of the insulating film;

    a thin film integrated circuit having the plurality of semiconductor films; and

    a metal oxide provided over the other surface of the insulating film.

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