Methods of sensing temperature of an electronic device workpiece
First Claim
1. An electronic device workpiece comprising:
- a substrate having a surface;
a temperature sensing device borne by the substrate; and
an electrical interconnect provided upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device.
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Abstract
The present invention includes electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece. In one aspect, the invention provides an electronic device workpiece including: a substrate having a surface; a temperature sensing device borne by the substrate; and an electrical interconnect formed upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. In another aspect, a method of sensing temperature of an electronic device workpiece includes: providing an electronic device workpiece; supporting a temperature sensing device using the electronic device workpiece; providing an electrical interconnect upon a surface of the electronic device workpiece; electrically coupling the electrical interconnect with the temperature sensing device; and sensing temperature of the electronic device workpiece using the temperature sensing device.
74 Citations
70 Claims
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1. An electronic device workpiece comprising:
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a substrate having a surface;
a temperature sensing device borne by the substrate; and
an electrical interconnect provided upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. An electronic device workpiece comprising:
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a substrate having a surface;
a cavity formed in the substrate, the cavity having sidewalls sloped at an angle within an approximate range of fifty to sixty degrees with respect to the surface of the substrate;
a temperature sensing device within the cavity of the substrate; and
an electrical interconnect coupled with the temperature sensing device. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A semiconductor workpiece comprising:
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a semiconductive substrate having a surface;
a temperature sensing device borne by the substrate; and
an electrical interconnect provided upon the surface of the substrate, the electrical interconnect being electrically coupled with the temperature sensing device. - View Dependent Claims (29, 30)
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31. A semiconductor workpiece comprising:
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a substrate having a surface and an edge;
a cavity formed in the substrate, the cavity having sidewalls sloped at an approximate fifty-four degree angle with respect to the surface of the substrate;
a resistance temperature device within the cavity of the substrate;
a plurality of conductive traces coupled with the resistance temperature device, the conductive traces being formed upon the surface of the substrate to contact the resistance temperature device, the conductive traces being configured to electrically couple the resistance temperature device with the edge of the substrate;
an isolator intermediate the surface of the electronic device workpiece and the conductive traces and the resistance temperature device; and
an interface connection in electrical connection with the conductive traces, the interface connection being configured to provide electrical coupling of the resistance temperature device with circuitry external of the semiconductor workpiece.
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32. A method of sensing temperature of an electronic device workpiece comprising:
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providing an electronic device workpiece;
supporting a temperature sensing device using the electronic device workpiece;
providing an electrical interconnect upon a surface of the electronic device workpiece;
electrically coupling the electrical interconnect with the temperature sensing device; and
sensing temperature of the electronic device workpiece using the temperature sensing device. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method of semiconductor processing, comprising:
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providing a semiconductor substrate;
anisotropically etching a cavity in the semiconductor substrate; and
providing a temperature sensing device within the cavity of the semiconductor substrate. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52)
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53. A method of sensing temperature of an electronic device workpiece comprising:
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providing an electronic device workpiece;
forming a temperature sensing device upon the electronic device workpiece, the forming including providing the temperature sensing device in a temperature sensing relation with the electronic device workpiece; and
sensing the temperature of the electronic device workpiece using the temperature sensing device. - View Dependent Claims (54, 55, 56, 57, 58, 59, 60, 61)
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62. A method of sensing temperature of an electronic device workpiece comprising:
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providing an electronic device workpiece;
supporting a temperature sensing device using the electronic device workpiece;
providing the temperature sensing device in a temperature sensing relation with the electronic device workpiece;
providing an electrical interconnect upon a surface of the electronic device workpiece; and
electrically coupling the electrical interconnect with the temperature sensing device. - View Dependent Claims (63, 64, 65, 66, 67, 68, 69, 70)
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Specification