Microstructures comprising a dielectric layer and a thin conductive layer
First Claim
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1. A micromachined apparatus comprising:
- a substrate; and
a released microstructure disposed on the substrate, comprising;
a dielectric layer, and a conductive polysilicon layer attached to the dielectric layer, wherein the polysilicon layer has a thickness less than ⅕
the dielectric layer thickness.
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Abstract
Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.
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Citations
20 Claims
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1. A micromachined apparatus comprising:
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a substrate; and
a released microstructure disposed on the substrate, comprising;
a dielectric layer, and a conductive polysilicon layer attached to the dielectric layer, wherein the polysilicon layer has a thickness less than ⅕
the dielectric layer thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A micromachined apparatus comprising:
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a substrate; and
a released microstructure disposed on the substrate, comprising;
a dielectric layer, and a conductive layer attached to the dielectric layer, wherein the conductive layer has a thickness less than ⅕
the dielectric layer thickness. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A micromachined apparatus comprising:
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a substrate; and
a released cantilever disposed on the substrate, comprising;
a silicon carbide dielectric layer, and a conductive layer attached to the dielectric layer, wherein the conductive layer has a thickness less than ⅕
the dielectric layer thickness.
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Specification