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Microstructures comprising a dielectric layer and a thin conductive layer

  • US 20040164423A1
  • Filed: 03/01/2004
  • Published: 08/26/2004
  • Est. Priority Date: 03/31/2000
  • Status: Active Grant
First Claim
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1. A micromachined apparatus comprising:

  • a substrate; and

    a released microstructure disposed on the substrate, comprising;

    a dielectric layer, and a conductive polysilicon layer attached to the dielectric layer, wherein the polysilicon layer has a thickness less than ⅕

    the dielectric layer thickness.

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