Barrier-forming film and manufacturing method thereof

• US 20040166239A1
• Filed: 02/24/2004
• Published: 08/26/2004
• Est. Priority Date: 10/13/2000
• Status: Active Grant

• Current Assignee: Atsuo Tsuzuki, Koujiro Ohkawa, Kuniaki Yoshikata
• Original Assignee: Atsuo Tsuzuki, Koujiro Ohkawa, Kuniaki Yoshikata
• Inventors: Yoshikata, Kuniaki, Ohkawa, Koujiro, Tsuzuki, Atsuo
• Granted Patent: US 7,192,625 B2
• Time in Patent Office: Days
• US Class Current: 427/248.1
• CPC Class Codes: C08J 7/048 Forming gas barrier coatings
• CPC Class Codes: C08J 7/052 Forming heat-sealable coatings
• CPC Class Codes: C08J 7/06 with compositions not containing macromolecular substances
• CPC Class Codes: C23C 14/081 of aluminium, magnesium or beryllium
• CPC Class Codes: C23C 14/10 Glass or silica
• CPC Class Codes: C23C 14/58 After-treatment
• CPC Class Codes: C23C 14/5806 Thermal treatment
• CPC Class Codes: C23C 16/401 containing silicon
• CPC Class Codes: C23C 16/407 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 16/56 After-treatment
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/31725 Of polyamide
• CPC Class Codes: Y10T 428/31728 Next to second layer of polyamide
• CPC Class Codes: Y10T 428/31736 Next to polyester
• CPC Class Codes: Y10T 428/31765 Inorganic-containing or next to inorganic-containing
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]

Abstract

The present invention provides a barrier-forming film (A) useful for manufacturing various packaging container, which has a higher barrier-formability to prevent permeation of oxygen gas or steam, and a manufacturing method thereof. The barrier-forming film of the invention comprises a substrate film (1) having a vapor-deposited film (2) of an inorganic oxide, and by applying an annealing treatment thereto to limit the steam permeability within a range of from 2.0 to 0.000001 g/m².day, and the oxygen permeability, within a range of from 2.0 to 0.000001 cc/m².day.

Claims

1. A manufacturing method of a barrier-forming film comprising the steps of providing a vapor-deposited inorganic oxides film on a side of a substrate film, and applying an annealing treatment to the substrate film having said vapor-deposited inorganic film.

3. A manufacturing method of a barrier-forming film according to any one of claims 1 and 2, wherein said vapor-deposited inorganic oxide film comprises a vapor-deposited silicon oxide film or a vapor-deposited aluminum oxide film.

4. A manufacturing method of a barrier-forming film according to any one of claims 1 to 3, wherein said annealing treatment comprises a heating treatment carried out at a heating treatment temperature of at least room temperature for a heating treatment time of at least 30 minutes.

5. A manufacturing method of a barrier-forming film according to any one of claims 1 to 4, wherein said annealing treatment is carried out at a heating treatment temperature within a range of from room temperature to 200°

C.

6. A manufacturing method of a barrier-forming film according to any one of claims 1 to 5, wherein said annealing treatment is carried out for a heating treatment time within a range of from 30 minutes to five days.

2. A manufacturing method of a barrier-forming film comprising the steps of providing a vapor-deposited inorganic oxides film on a side of a substrate film, and applying an annealing treatment to the substrate film having said vapor-deposited inorganic film, to cause thermal shrinkage of the substrate film composing the substrate film having the vapor-deposited inorganic oxide film, and to increase density of the vapor-deposited inorganic oxide film.

7. A manufacturing method of a barrier-forming film, comprising the steps of providing a vapor-deposited silicon oxide film on one side of a substrate film, and heat-treating the substrate film having said vapor-deposited silicon oxide film at a heat treatment temperature of at least room temperature for a heat treatment time of at least one hour.