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Low temperature wafer-level micro-encapsulation

  • US 20040166606A1
  • Filed: 12/03/2003
  • Published: 08/26/2004
  • Est. Priority Date: 02/26/2003
  • Status: Abandoned Application
First Claim
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1. A method for packaging at least one microscopic device, comprising:

  • applying a sacrificial material to at least one microscopic device;

    applying a layer of structural material adjacent the sacrificial material, the layer of structural material forming a housing adjacent at least a portion of the sacrificial material;

    creating one or more apertures in the housing of structural material to expose at least a portion of the adjacent sacrificial material;

    removing the sacrificial layer, wherein the housing of structural material with at least one aperture remains;

    depositing a protective material adjacent the housing of structural material overlaying at least one aperture of the housing; and

    curing the protective material.

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