Low temperature wafer-level micro-encapsulation
First Claim
Patent Images
1. A method for packaging at least one microscopic device, comprising:
- applying a sacrificial material to at least one microscopic device;
applying a layer of structural material adjacent the sacrificial material, the layer of structural material forming a housing adjacent at least a portion of the sacrificial material;
creating one or more apertures in the housing of structural material to expose at least a portion of the adjacent sacrificial material;
removing the sacrificial layer, wherein the housing of structural material with at least one aperture remains;
depositing a protective material adjacent the housing of structural material overlaying at least one aperture of the housing; and
curing the protective material.
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Accused Products
Abstract
A method and apparatus are provided for encapsulated micro-devices. More particularly, Microelectromechanical Systems (MEMS) switches are encapsulated. The method and apparatus involve the creation of a cage structure over the micro-devices and the application of a low-temperature liquid protective material onto the cage and subsequent curing to form a hermetic micro-encapsulation. The technique and devices employ the use of conventional semiconductor manufacturing equipment that greatly increase productivity and reduces costs over more conventional techniques and devices for protect similar micro-devices.
63 Citations
67 Claims
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1. A method for packaging at least one microscopic device, comprising:
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applying a sacrificial material to at least one microscopic device;
applying a layer of structural material adjacent the sacrificial material, the layer of structural material forming a housing adjacent at least a portion of the sacrificial material;
creating one or more apertures in the housing of structural material to expose at least a portion of the adjacent sacrificial material;
removing the sacrificial layer, wherein the housing of structural material with at least one aperture remains;
depositing a protective material adjacent the housing of structural material overlaying at least one aperture of the housing; and
curing the protective material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for packaging at least one microscopic device, comprising:
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means for applying a sacrificial material to at least one microscopic device;
means for applying a layer of structural material adjacent the sacrificial material, the layer of structural material forming a housing adjacent at least a portion of the sacrificial material;
means for creating one or more apertures in the housing of structural material to expose at least a portion of the adjacent sacrificial material;
means for removing the sacrificial layer, wherein the housing of structural material with at least one aperture remains;
means for depositing a protective material adjacent the housing of structural material overlaying at least one aperture of the housing; and
means for curing the protective material. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method for packaging at least one microscopic device, comprising:
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forming a housing with at least one aperture over the microscopic device;
depositing a protective material adjacent at least a portion of the housing, wherein the protective material at least flows into at least one aperture of the housing, sealing the aperture, but does not flow into at least one of the movable regions of the microscopic device; and
curing the protective material. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. An apparatus for packaging a microscopic device, comprising:
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mean for forming a housing with at least one aperture over the microscopic device;
means for depositing a protective material adjacent at least a portion of the housing, wherein the protective material at least flows into at least one aperture of the housing, sealing the aperture, but does not flow into at least one of the movable regions of the microscopic device; and
means for curing the protective material. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method for packaging at least one microscopic device, comprising:
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forming a housing with at least one aperture over the at least one microscopic device;
depositing a protective material adjacent at least a portion of the housing, wherein the protective material flows at least partially into at least one aperture of the housing, sealing the aperture, but does not flow into at least one of the movable regions of the microscopic device; and
curing the protective material. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. An apparatus for packaging at least one microscopic device, comprising:
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means for forming a housing with at least one aperture over the at least one microscopic device;
means for depositing a protective material adjacent to at least a portion of the housing, wherein the protective material flows at least partially into at least one aperture of the housing, sealing the aperture, but does not flow into at least one of the movable regions of the microscopic device; and
means for curing the protective material. - View Dependent Claims (55, 56, 57, 58, 59, 60, 61, 62, 63)
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64. A method for packaging at least one microscopic device, comprising:
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providing a gas atmosphere, wherein the pressure is greater than or equal to 1 Pascal (Pa);
providing a temperature of less than 600°
Celsius (C);
forming a housing with at least one aperture over the at least one microscopic device;
depositing a protective material adjacent to the housing; and
curing the protective material.
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65. An apparatus for packaging at least one microscopic device, comprising:
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means for providing a gas atmosphere, wherein the pressure is greater than or equal to 1 Pascal (Pa);
means for providing a temperature of less than 600°
Celsius (C);
means for forming a housing with at least one aperture over the at least one microscopic device;
means for depositing a protective material adjacent to the protective material; and
means for curing the protective material.
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66. A method for packaging at least one microscopic device, comprising:
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forming a housing with at least one aperture over the at least one microscopic device;
placing a protective material adjacent to at least a portion of the housing forming a protective layer on the housing, wherein the protective material extends at least partially into at least one aperture of the housing, sealing the aperture, but does not extend into at least one of the movable regions of the microscopic device; and
allowing or causing the protective layer to harden.
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67. An apparatus for packaging a microscopic device, comprising:
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a housing having at least a portion positioned out of contact with the microscopic device, and having one or more apertures; and
a protective layer deposited over the housing, wherein the protective layer comprises material at least partially extending into and sealing at least one aperture of the housing and remaining out of contact with the microscopic device.
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Specification