Layer transfer method
First Claim
1. A method for transferring a transferable layer of material onto a support substrate, the method comprising:
- joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive;
treating the connection zone to increase adhesion properties of the adhesive; and
detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone.
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Accused Products
Abstract
The invention relates to a method of removing a peripheral zone of adhesive while using a layer of adhesive in the process of assembling and transferring a layer of material from a source substrate to a support substrate. The method is remarkable in that it includes bonding the two substrates together by means of a curable adhesive so that an excess of adhesive is present. This assures proper bonding and provides a peripheral zone of adhesive outside of the joined substrates. Only that portion of adhesive is cured which is present in a connection zone between the substrates, and the peripheral zone of non-cured adhesive is removed prior to detaching the transferable layer. The invention is applicable to fabricating a composite substrate in the fields of electronics, opto-electronics, or optics.
253 Citations
21 Claims
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1. A method for transferring a transferable layer of material onto a support substrate, the method comprising:
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joining a source substrate that includes a transferable layer to a support substrate that is to receive the transferable layer by depositing an adhesive onto a surface of at least one of the substrates to create a connection zone between the substrates which connection zone includes the adhesive;
treating the connection zone to increase adhesion properties of the adhesive; and
detaching the transferable layer from the source substrate to provide the support substrate with the transferable layer and the connection zone. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification