Reduced cross-contamination between chambers in a semiconductor processing tool
First Claim
1. A method of transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer chamber and the process chamber, the method comprising:
- flowing an inert gas into the process chamber while the gate valve is closed;
turning off the inert gas flowing into the process chamber while the gate valve is closed;
flowing an inert gas into the transfer chamber;
opening the gate valve while flowing inert gas into the transfer chamber and while the flowing of inert gas into the process chamber remains off; and
transferring the workpiece between the transfer chamber and the process chamber through the opened gate valve.
1 Assignment
0 Petitions
Accused Products
Abstract
In accordance with one aspect of the present invention, a method is provided for transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer chamber and the process chamber. The method comprises vacuum pumping the transfer chamber to achieve a first pressure in the transfer chamber and vacuum pumping the process chamber to achieve a second pressure in the process chamber. An inert gas is flowed into the transfer chamber and shut off in the process chamber. The transfer chamber is isolated from pumping, but pumping continues from the process chamber. The gate valve is opened after isolating the transfer chamber from pumping. The workpiece is then transferred between the transfer chamber and the process chamber. A definitive flow direction from transfer chamber to process chamber is thereby achieved, minimizing risk of back-diffusion.
-
Citations
20 Claims
-
1. A method of transporting a workpiece in a semiconductor processing apparatus comprising a transfer chamber, a process chamber, and a gate valve between the transfer chamber and the process chamber, the method comprising:
-
flowing an inert gas into the process chamber while the gate valve is closed;
turning off the inert gas flowing into the process chamber while the gate valve is closed;
flowing an inert gas into the transfer chamber;
opening the gate valve while flowing inert gas into the transfer chamber and while the flowing of inert gas into the process chamber remains off; and
transferring the workpiece between the transfer chamber and the process chamber through the opened gate valve. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A method of transporting a workpiece in a semiconductor processing apparatus, comprising:
-
operating a first pump in fluid communication with a first chamber of the processing apparatus to achieve a first pressure in the first chamber;
operating a second pump in fluid communication with a second chamber of the processing apparatus to achieve a second pressure in the second chamber;
flowing an inert gas into the first chamber;
opening a gate valve positioned between the first chamber and the second chamber while flowing inert gas into the first chamber;
isolating the first pump from the first chamber prior to opening the gate valve; and
transferring the workpiece through the gate valve between the first chamber and the second chamber. - View Dependent Claims (11, 12, 13, 14, 15)
-
-
16. A method of transferring a semiconductor workpiece in a cluster tool for processing workpieces comprising a first chamber, a second chamber, and a gate valve positioned between the first chamber and the second chamber, the method comprising:
-
operating a first pump to create a first pressure in the first chamber;
operating a second pump to create a second pressure in the second chamber, wherein the second pressure is lower than the first pressure;
isolating the first pump from the first chamber;
flowing purge gas into the first chamber before isolating the first pump;
opening the gate valve while the purge gas is flowing; and
transferring the workpiece through the open gate valve between the first chamber and the second chamber - View Dependent Claims (17, 18, 19, 20)
-
Specification