Thin profile battery bonding method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit
First Claim
1. A thin profile battery bonding method comprising:
- providing a curable adhesive composition comprising an epoxy terminated silane;
providing a thin profile battery and a substrate to which the thin profile battery is to be conductively connected;
interposing the curable adhesive composition between the thin profile battery and the substrate; and
curing the adhesive into an electrically conductive bond electrically interconnecting the battery and the substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.3 ohm-cm2. In another aspect, a battery powerable apparatus includes a conductive adhesive mass comprising an epoxy terminated silane between a battery and substrate. A radio frequency communication device is one example. In another aspect, the invention includes an electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass comprising an epoxy terminated silane.
27 Citations
50 Claims
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1. A thin profile battery bonding method comprising:
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providing a curable adhesive composition comprising an epoxy terminated silane;
providing a thin profile battery and a substrate to which the thin profile battery is to be conductively connected;
interposing the curable adhesive composition between the thin profile battery and the substrate; and
curing the adhesive into an electrically conductive bond electrically interconnecting the battery and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of conductively interconnecting electronic components:
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providing a curable adhesive composition comprising an epoxy terminated silane;
providing first and second electronic components to be conductively connected with one another;
interposing the curable adhesive composition between the first and second electronic components; and
curing the adhesive into an electrically conductive bond electrically interconnecting the first and second components. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A thin profile battery bonding method comprising:
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interposing a curable epoxy composition between a thin profile battery and a substrate to which the thin profile battery is to be conductively connected, at least one of the battery and substrate comprising a metal surface with which the curable epoxy is to electrically connect; and
curing the epoxy into an electrically conductive bond electrically interconnecting the battery and the substrate the epoxy having an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a contact resistance through said metal surface of less than or equal to about 0.3 ohm-cm2. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A method of conductively interconnecting electronic components comprising:
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interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected, at least one of the components comprising a metal surface with which the curable epoxy is to electrically connect; and
curing the epoxy into an electrically conductive bond electrically interconnecting the first and second components, the epoxy having an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a contact resistance through said metal surface of less than or equal to about 0.3 ohm-cm2. - View Dependent Claims (24, 25, 26, 27, 28)
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29. A battery powerable apparatus comprising:
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a substrate having a surface comprising at least one node location;
a thin profile battery mounted over the substrate and node location; and
a conductive adhesive mass electrically interconnecting the thin profile battery with the node location, the conductive adhesive mass comprising an epoxy terminated silane. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36)
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37. A radio frequency communication device comprising:
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a substrate having conductive paths including an antenna;
at least one integrated circuit chip mounted to the substrate and in electrical connection with a first portion of the substrate conductive paths; and
a thin profile battery conductively bonded with a second portion of the substrate conductive paths by a conductive adhesive mass, the conductive adhesive mass comprising an epoxy terminated silane. - View Dependent Claims (38, 39, 40, 41, 42, 43, 44)
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- 45. An electric circuit comprising first and second electric components electrically connected with one another through a conductive adhesive mass comprising an epoxy terminated silane.
Specification