Methods for preparing ball grid array substrates via use of a laser
First Claim
Patent Images
1. An automolding system comprising:
- providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser.
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
99 Citations
9 Claims
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1. An automolding system comprising:
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providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (2, 3)
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4. A molding system comprising:
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providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (5, 6)
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7. A system for molding comprising:
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providing a substrate having a surface;
preheating the substrate;
forming a resist layer;
baking the substrate; and
removing contaminants from the substrate using a laser. - View Dependent Claims (8, 9)
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Specification