Ic card
First Claim
1. An IC card comprising:
- an IC module which comprises an IC chip mounted on an insulating substrate, and a reinforcing sheet provided over said IC chip through a sealing resin for sealing said IC chip;
a card substrate comprised of a resin for sealing said IC module; and
a reversible display layer provided on at least one surface of said card substrate, said IC card being characterized in that a reinforcing film pattern having an opening which exposes an IC chip mounted portion is provided on at least one of an IC chip mounted surface and a non-mounted surface of said insulating substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
An IC card having high reliability, which is not only in that printing can be surely conducted with respect to the reversible display layer provided on the surface of the card substrate, but also in that the IC chip is surely protected by the reinforcing sheet. An IC card which has: an IC module (1) including an IC chip (14) mounted on an insulating substrate (11), and a reinforcing sheet (16) provided over the IC chip (14) through a sealing resin (15) for sealing the IC chip (14); a card substrate (2) comprised of a resin for sealing the IC module (1); and a reversible recording layer (3) provided on at least one surface of the card substrate (2), wherein reinforcing film patterns (13), (13′) having openings (13a), (13a′) which expose the IC chip (14) mounted portion are provided on at least one of the IC chip (14) mounted surface and the non-mounted surface of the insulating substrate (11).
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Citations
8 Claims
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1. An IC card comprising:
- an IC module which comprises an IC chip mounted on an insulating substrate, and a reinforcing sheet provided over said IC chip through a sealing resin for sealing said IC chip;
a card substrate comprised of a resin for sealing said IC module; and
a reversible display layer provided on at least one surface of said card substrate,said IC card being characterized in that a reinforcing film pattern having an opening which exposes an IC chip mounted portion is provided on at least one of an IC chip mounted surface and a non-mounted surface of said insulating substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
- an IC module which comprises an IC chip mounted on an insulating substrate, and a reinforcing sheet provided over said IC chip through a sealing resin for sealing said IC chip;
Specification