Miniature 3-dimensional package for MEMS sensors

• US 20040169244A1
• Filed: 02/28/2003
• Published: 09/02/2004
• Est. Priority Date: 02/28/2003
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: MacGugan, Douglas C.
• Granted Patent: US 6,918,297 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: H01R 33/88 adapted for simultaneous co-operation with two or more identical counterparts

Abstract

An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base being a generally cubical block formed in a ceramic substrate having a plurality of substantially planar and mutually orthogonal surfaces, wherein a first one of the surfaces is structured for rotationally interfacing with a host structure that is to be monitored; one or more of the remaining surfaces is structured for mechanically mounting of a MEMS sensor; and a plurality of electrical signal carriers communicate between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

Claims

1. An apparatus for mounting one or more Micro Electro-Mechanical System (MEMS) sensors, the apparatus comprising:

means for orthogonally orienting each of one or more MEMS sensor mounting surfaces relative to a common interface surface;

means for routing electrical power, ground and operational signals between each sensor mounting surfaces and the common interface surface; and

means for rotationally interfacing the common interface surface with an external key mechanism.

2. The mounting apparatus of claim 1, further comprising means for mechanically securing the common interface surface to a host structure that is to be monitored.

3. The mounting apparatus of claim 1, further comprising a MEMS sensor mounted on one or more of the sensor mounting surfaces, each of the MEMS sensors being electrically coupled to the means for routing electrical power, ground and operational signals.

4. The mounting apparatus of claim 3, further comprising means for hermetically sealing each of the one or more MEMS sensors.

5. The mounting apparatus of claim 1 wherein the means for orthogonally orienting each of one or more MEMS sensor mounting surfaces relative to a common interface surface further comprises means for mounting each of the one or more MEMS sensors below a structural surface of a generally cubical ceramic mounting block.

6. The mounting apparatus of claim 5, further comprising means for hermetically sealing each of the one or more MEMS sensors.

7. An apparatus for mechanically mounting one or more Micro Electro-Mechanical System (MEMS) sensors on a stable, structurally sound base, the base comprising:

a generally cubical block formed in a substrate having a plurality of substantially planar and mutually orthogonal surfaces;

a first one of the surfaces being structured for rotationally interfacing with a host structure that is to be monitored;

a second one of the surfaces being structured for mechanically mounting of a MEMS sensor; and

a plurality of electrical signal carriers communicating between the MEMS sensor mounting surface and a plurality of electrical interface contacts positioned on the interfacing surface.

8. The apparatus of claim 7 wherein the substrate further comprises a ceramic substrate.

9. The apparatus of claim 7 wherein the first surface structured for rotationally interfacing with a host structure further comprises a structural key oriented diagonally to the surface.

10. The apparatus of claim 7 wherein the generally cubical block further comprises a generally cylindrical aperture communicating between the interfacing surface and a surface of the block opposite thereto.

11. The apparatus of claim 7 wherein the generally cubical block further comprises a plurality of surfaces structured for mechanically mounting of a MEMS sensor;

a plurality of electrical signal carriers communicating between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface; and

further comprising a MEMS sensor being mounted to each of the MEMS sensor mounting surfaces and electrically interfaced to the electrical signal carriers.

12. The apparatus of claim 11 wherein each of the MEMS sensors further comprises a MEMS sensor packaged in a hermetically sealed leaded chip carrier (LCC).

13. The apparatus of claim 11 wherein each of the plurality of surfaces structured for mechanically mounting of a MEMS sensor further comprises a recessed cavity formed in and peripherally surrounded by a surface of the block;

and

further comprising a cover installed over each MEMS sensor and sealed to the surface of the block.

14. The apparatus of claim 13 wherein the seals between each of the covers and the block further comprises a hermetic seal.

15. A mounting apparatus for one or more Micro Electro-Mechanical System (MEMS) sensors, the apparatus comprising:

a generally cubical ceramic block having two or more mutually orthogonal surfaces;

structure being formed in a first one of the surfaces for mechanically mounting of a single MEMS sensor;

structure being formed in a second one of the surfaces for mechanically interfacing with a host structure that is to be monitored;

a structural key being formed in the second one of the surfaces for rotationally interfacing with an external key mechanism; and

a plurality of electrical signal carriers communicating between the first surface and a plurality of electrical interface contacts positioned on the second surface.

16. The mounting apparatus of claim 15, further comprising:

at least three mutually orthogonal surfaces;

structure being formed in at least two of the surfaces for mechanically mounting of a single MEMS sensor; and

a plurality of electrical signal carriers communicating between each of the MEMS sensor mounting surfaces and a plurality of electrical interface contacts positioned on the interfacing surface.

17. The mounting apparatus of claim 16 further comprising a single MEMS sensor mounted on each of the MEMS sensor mounting surfaces and electrically interfaced with the electrical signal carriers.

18. The mounting apparatus of claim 15 wherein the structure formed in the first one of the surfaces for mechanically mounting of a MEMS sensor further comprises a surface recessed in a face of the cubical block.

19. The mounting apparatus of claim 18 wherein the recessed surface further comprises a MEMS sensor mounting surface communicating with the interfacing surface along one mutually contiguous border.

20. The mounting apparatus of claim 15, further comprising structure for mechanically securing the ceramic block to the host structure.