Compliant package with conductive elastomeric posts
First Claim
1. An assembly comprising:
- a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and
conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
2 Assignments
0 Petitions
Accused Products
Abstract
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
-
Citations
7 Claims
-
1. An assembly comprising:
-
a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and
conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method of manufacturing an assembly comprising:
-
providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface;
providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface;
forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element; and
injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
-
Specification