Circuit arrangement

• US 20040169268A1
• Filed: 08/27/2003
• Published: 09/02/2004
• Est. Priority Date: 02/27/2001
• Status: Active Grant

• Current Assignee: Continental Automotive GmbH (Continental AG)
• Original Assignee: Siemens AG
• Inventors: Kirchberger, Michael, Rappl, Hans, Gross, Kurt, Auerswald, Gerd, Kulig, Stefan
• Granted Patent: US 6,930,373 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/0101 Neon [Ne]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01031 Gallium [Ga]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01065 : Terbium [Tb]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19041 : being a capacitor

Abstract

The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

Claims

1. Circuit arrangement comprising:

a power section, which comprises heat-generating components and at least one component producing less heat,

the component producing less heat being arranged in an internal region of the circuit arrangement, and

the heat-generating components being arranged around the internal region and being mounted on at least one metallic body acting as an electrical conductor, said body being electrically connected to the heat-generating components,

wherein

the body is arranged in an electrically insulating manner in the region of the heat-generating components on a heat sink, in order to cool the heat-generating components, and wherein

the heat sink is embodied running around the internal region with the components producing less heat.

2. Circuit arrangement according to claim 1, further comprising:

a logic section, which is arranged above the internal region,

wherein the logic section being electrically connected to the power section via bonding connections.

3. Circuit arrangement according to claim 2, further comprising:

a metallic board, which covers the internal region and is arranged above the component producing less heat,

wherein the board having at least one opening above the internal region and the component producing less heat being electrically connected to the board via a first wired bond, which is led through the opening,

a carrier, which is arranged in an electrically insulating manner above the internal region and above the board,

wherein the surface of the carrier facing the board having an indentation in the region of the first wired bond, to accommodate the first wired bond,

wherein the surface of the carrier facing away from the board being essentially flat, and

wherein the logic section being arranged in an electrically insulating manner on the surface of the carrier facing away from the board.

4. Circuit arrangement according to claim 3,

wherein the carrier being essentially made of aluminum.

5. Circuit arrangement according to claim 1, further comprising:

a metallic board, which covers the internal region and is arranged above the component producing less heat,

wherein

the board comprising at least one opening above the internal region,

the component producing less heat being embodied as a capacitor and being electrically connected to the board via a first wired bond, which is led through the opening,

the heat-generating components being embodied as bare first chips and second chips, each containing a transistor, with the first chips being mounted on at least one first metallic body and the second chips being mounted on a second metallic body,

the first body being embodied as a bar, which runs along the outer edge of the heat sink,

the second body being embodied as a board, which covers the internal region and inner edge of the heat sink,

the board being arranged in an electrically insulating manner on the second body,

the second body having a first opening above the internal region, which is arranged under the opening of the board and through which the first wired bond is led,

the second body having at least one second opening above the internal region,

the component producing less heat being electrically connected to the second body via a second wired bond, which is led through the second opening,

the first chips being electrically connected to the board via bonding connections, and

the second chips being electrically connected to the first body via bonding connections.

6. Circuit arrangement according to claim 2, further comprising:

a metallic board, which covers the internal region and is arranged above the component producing less heat,

wherein

the board comprising at least one opening above the internal region,

the component producing less heat being embodied as a capacitor and being electrically connected to the board via a first wired bond, which is led through the opening,

the heat-generating components being embodied as bare first chips and second chips, each containing a transistor, with the first chips being mounted on at least one first metallic body and the second chips being mounted on a second metallic body,

the first body being embodied as a bar, which runs along the outer edge of the heat sink,

the second body being embodied as a board, which covers the internal region and inner edge of the heat sink,

the board being arranged in an electrically insulating manner on the second body,

the second body having a first opening above the internal region, which is arranged under the opening of the board and through which the first wired bond is led,

the second body having at least one second opening above the internal region,

the component producing less heat being electrically connected to the second body via a second wired bond, which is led through the second opening,

the first chips being electrically connected to the board via bonding connections, and

the second chips being electrically connected to the first body via bonding connections.

7. Circuit arrangement according to claim 3, further comprising:

a metallic board, which covers the internal region and is arranged above the component producing less heat,

wherein

the board comprising at least one opening above the internal region,

the component producing less heat being embodied as a capacitor and being electrically connected to the board via a first wired bond, which is led through the opening,

the heat-generating components being embodied as bare first chips and second chips, each containing a transistor, with the first chips being mounted on at least one first metallic body and the second chips being mounted on a second metallic body,

the first body being embodied as a bar, which runs along the outer edge of the heat sink,

the second body being embodied as a board, which covers the internal region and inner edge of the heat sink,

the board being arranged in an electrically insulating manner on the second body,

the second body having a first opening above the internal region, which is arranged under the opening of the board and through which the first wired bond is led,

the second body having at least one second opening above the internal region,

the component producing less heat being electrically connected to the second body via a second wired bond, which is led through the second opening,

the first chips being electrically connected to the board via bonding connections, and

the second chips being electrically connected to the first body via bonding connections.

8. Circuit arrangement according to claim 4, further comprising:

a metallic board, which covers the internal region and is arranged above the component producing less heat,

wherein

the board comprising at least one opening above the internal region,

the component producing less heat being embodied as a capacitor and being electrically connected to the board via a first wired bond, which is led through the opening,

the heat-generating components being embodied as bare first chips and second chips, each containing a transistor, with the first chips being mounted on at least one first metallic body and the second chips being mounted on a second metallic body,

the first body being embodied as a bar, which runs along the outer edge of the heat sink,

the second body being embodied as a board, which covers the internal region and inner edge of the heat sink,

the board being arranged in an electrically insulating manner on the second body,

the second body having a first opening above the internal region, which is arranged under the opening of the board and through which the first wired bond is led,

the second body having at least one second opening above the internal region,

the component producing less heat being electrically connected to the second body via a second wired bond, which is led through the second opening,

the first chips being electrically connected to the board via bonding connections, and

the second chips being electrically connected to the first body via bonding connections.

9. Circuit arrangement according to claim 5,

wherein the first body, second body and board being essentially made of copper.