Methods and apparatus for testing optical and electrical components

• US 20040169520A1
• Filed: 12/16/2003
• Published: 09/02/2004
• Est. Priority Date: 12/16/2002
• Status: Abandoned Application

• Current Assignee: Tellabs Operations Incorporated (Infinera Corp.)
• Original Assignee: Tellabs Operations Incorporated (Infinera Corp.)
• Inventors: Larikova, Julia Y., Wang, Yajun
• Application Number:
  US10/737,392
• Publication Number:
  US 20040169520A1
• Time in Patent Office: Days
• US Class Current: 324/753
• CPC Class Codes: G01R 1/06772 High frequency probes
• CPC Class Codes: G01R 31/2803 by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor testing electronic digital computers G06F11/00
• CPC Class Codes: G01R 31/2818 using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors G01R31/2805 takes precedence; printed circuits having, e.g. symbols, test patterns or visualisation means H05K1/0266

Abstract

A method for testing a test component connected to a high-speed electrical component includes connecting a golden optical component to a high-frequency probe, connecting the high-frequency probe to the high-speed electrical component, operating the test component in an application environment to cause a transmission of a high-speed electrical signal from the high-speed electrical component to the golden optical component, and determining if the golden optical component responds to the high-speed electrical signal.

Claims

1. An apparatus for testing in an application environment, comprising:

a high-frequency probe; and

a holder adapted to removably connect an optical component to the high-frequency probe and adapted to removably connect the high-frequency probe to an application substrate.

2. The apparatus of claim 1, wherein the holder comprises G10 material.

3. The apparatus of claim 1, wherein the holder comprises Teflon material.

4. The apparatus of claim 1, wherein the high-frequency probe is double-spring loaded.

5. The apparatus of claim 1, wherein the high-frequency probe is single-spring loaded.

6. A method for testing an optical component, comprising:

connecting the optical component to a high-frequency probe;

connecting the high-frequency probe to a golden high-speed electrical component;

transmitting a high-speed electrical signal from the golden high-speed electrical component to the optical component; and

identifying a response by the optical component to the high-speed electrical signal.

7. The method of claim 6, further comprising evaluating the response by the optical component.

8. The method of claim 6, further comprising adjusting the high-speed electrical signal.

9. The method of claim 7, wherein the step of evaluating the response by the optical component comprises determining if the optical component responds in substantially the same manner as a golden optical component would respond to a substantially equivalent high-speed electrical signal.

10. The method of claim 7, wherein the step of evaluating the response by the optical component comprises comparing if the response is substantially the same as a golden optical component response to a substantially equivalent high-speed electrical signal.

11. A method for testing a test component connected to a high-speed electrical component, comprising:

connecting a golden optical component to a high-frequency probe;

connecting the high-frequency probe to the high-speed electrical component;

operating the test component in an application environment to cause a transmission of a high-speed electrical signal from the high-speed electrical component to the golden optical component; and

determining if the golden optical component responds to the high-speed electrical signal.

12. The method of claim 11, further comprising evaluating a response by the golden optical component.

13. The method of claim 11, further comprising adjusting the high-speed electrical signal.

14. The method of claim 12, wherein the step of evaluating a response by the golden optical component comprises determining if the golden optical component responds in substantially the same manner as the golden optical component would respond to a substantially equivalent high-speed electrical signal caused by a golden test component operation.

15. The method of claim 12, wherein the step of evaluating a response by the golden optical component comprises comparing if the response is substantially the same as a second golden optical component response to a substantially equivalent high-speed electrical signal caused by a golden test component operation.

16. A method for testing a test component connected to a high-speed electrical component, comprising:

connecting a golden optical component to a high-frequency probe;

connecting the high-frequency probe to the high-speed electrical component;

transmitting a high-speed electrical signal from the golden optical component to the high-speed electrical component; and

identifying a response by the test component.

17. The method of claim 16, further comprising evaluating the response by the test component.

18. The method of claim 16, further comprising adjusting the high-speed electrical signal.

19. The method of claim 17, wherein the step of evaluating the response by the test component comprises determining if the test component responds in substantially the same manner as a golden test component would respond.

20. The method of claim 17, wherein the step of evaluating the response by the test component comprises comparing if the response is substantially the same as a golden test component response.