Method of protecting microfabricated devices with protective caps
First Claim
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1. A method including:
- a) providing a wafer having a plurality of microfabricated devices formed thereon;
b) applying a plurality of substantially hollow caps to a first side of the wafer, the caps positioned such that, in plan view, each cap overlays part or all of at least one microfabricated device and whereby the periphery of each cap is remote from the periphery of any adjacent cap;
c) applying one or more etches to the wafer from the first side toward the other side to etch away at least some of the material between the peripheries of said caps to separate the wafer into separate units.
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Abstract
A method of using protective caps (160) applied to a first side of a wafer (150) in the production of microfabricated devices (152), such as micro-electro-mechanical systems (MEMS) devices. One cap (160) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.
7 Citations
7 Claims
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1. A method including:
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a) providing a wafer having a plurality of microfabricated devices formed thereon;
b) applying a plurality of substantially hollow caps to a first side of the wafer, the caps positioned such that, in plan view, each cap overlays part or all of at least one microfabricated device and whereby the periphery of each cap is remote from the periphery of any adjacent cap;
c) applying one or more etches to the wafer from the first side toward the other side to etch away at least some of the material between the peripheries of said caps to separate the wafer into separate units. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification