In vivo sensing device with a circuit board having rigid sections and flexible sections

• US 20040171914A1
• Filed: 12/18/2003
• Published: 09/02/2004
• Est. Priority Date: 06/18/2001
• Status: Active Grant

• Current Assignee: Given Imaging Limited (Medtronic Plc)
• Original Assignee: Given Imaging Limited (Medtronic Plc)
• Inventors: Avni, Dov
• Granted Patent: US 7,998,065 B2
• Time in Patent Office: Days
• US Class Current: 600/160
• CPC Class Codes: A61B 1/041 Capsule endoscopes for imaging
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A device including at least one image sensor and a circuit board having a plurality of rigid sections and a plurality of flexible sections. The image sensor is disposed an a rigid section of the circuit board The circuit board may be folded into a housing configured for in vivo sensing.

Claims

1. An in vivo sensing device comprising a circuit board having a plurality of rigid sections and a plurality of flexible sections.

2. The device according to claim 1 and also comprising a sensor.

3. The device according to claim 2 wherein the sensor is an image sensor.

4. The device according to claim 2 wherein the sensor is selected from the group consisting of a pH sensor, a temperature sensor and a pressure sensor.

5. The device according to claim 1 further comprising an image sensor.

6. The device according to claim 2 and also comprising a transmitter.

7. The device according to claim 1 further comprising at least one component selected from the group consisting of an illumination source, a power source, a sensor, a processor, a transmitter or a combination thereof.

8. The device according to claim 7 wherein at least one component is disposed on at least one rigid section of the circuit board.

9. The device according to claim 7 wherein a plurality of components are disposed on a plurality of rigid sections of the circuit board.

10. The device according to claim 6 wherein the sensor is disposed on a rigid section of the circuit board and the transmitter is disposed on another rigid section of the circuit board.

11. The device according to claim 1 wherein the rigid sections alternate with the flexible sections.

12. The device according to claim 1 wherein the circuit board is folded such that the rigid sections of the circuit board are stacked vertically.

17. The device according to claim 1 wherein the circuit board includes flexiglass.

18. The device according to claim 9 wherein the components are electrically connected through micro-via in the rigid sections.

13. The device according to claim 13 wherein the rigid sections are connected by vertical connectors.

14. The device according to claim 13 wherein the vertical connectors are electrical conductors.

15. The device according to claim 13 wherein the vertical connectors are springs.

16. The device according to claim 15 wherein the springs are conical springs.

19. A method for the manufacture of an in vivo sensor, the method comprising the steps of:

disposing at least a sensor on a rigid section of a circuit board having a plurality of rigid sections and a plurality of flexible sections; and

folding the circuit board into a housing configured for in vivo sensing.

20. The method according to claim 19 wherein the step of folding the circuit board includes folding the circuit board such that the rigid sections of the circuit board are stacked vertically.

21. A device comprising at least one in vivo sensor and a circuit board having a plurality of rigid sections and a plurality of flexible sections, wherein the sensor is disposed on at least one rigid section of the circuit board.

22. A device comprising at least one image sensor and a circuit board having a plurality of rigid sections and a plurality of flexible sections, wherein the image sensor is disposed on at least one rigid section of the circuit board.

23. The device according to claim 22 further comprising a transmitter for transmitting image signals, said transmitter disposed on another rigid section of the circuit board.