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Micromachined assembly with a multi-layer cap defining a cavity

  • US 20040173886A1
  • Filed: 03/07/2003
  • Published: 09/09/2004
  • Est. Priority Date: 03/07/2003
  • Status: Active Grant
First Claim
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1. A method of creating a sealed cavity on a wafer comprising the steps of:

  • depositing one or more layers of a sacrificial material on said wafer and shaping said sacrificial material;

    depositing a first cap layer on said one or more layers of sacrificial material;

    removing said one or more layers of sacrificial material such that said first cap layer and the portion of said wafer underlying said first cap layer define said cavity; and

    depositing one or more additional cap layers on said first cap layer, said one or more additional cap layers being formed of a high stiffness material;

    wherein said one or more cap layers contact said wafer.

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