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Test vehicle ball grid array package

  • US 20040173887A1
  • Filed: 07/14/2003
  • Published: 09/09/2004
  • Est. Priority Date: 03/04/2003
  • Status: Active Grant
First Claim
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1. A test vehicle ball grid array package comprising:

  • a PCB having bonding fingers;

    an adhesive material being coated on an edge of the PCB;

    a sealing post being adhered on the adhesive material;

    a semiconductor testing chip having a plurality of bonding pads adhered on the PCB;

    a plurality of metal wires separately connecting bonding pads of the PCB to the bonding fingers of the PCB;

    a sealing cap adhered on a sealing post for sealing the semiconductor chip; and

    a plurality of solder balls adhered to a lower side of the PCB.

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