Test vehicle ball grid array package

• US 20040173887A1
• Filed: 07/14/2003
• Published: 09/09/2004
• Est. Priority Date: 03/04/2003
• Status: Active Grant

• Current Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Original Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Inventors: Lee, Sang Kwon, Jang, Chae Kyu
• Granted Patent: US 7,193,315 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

A TV-BGA package comprises: a PCB having bonding fingers; an adhesive material being coated on an edge of the PCB; a sealing post being adhered on the adhesive material; a semiconductor testing chip having a plurality of bonding pads adhered on the PCB; a plurality of metal wires separately connecting bonding pads of the PCB to the bonding fingers of the PCB; a sealing cap adhered on a sealing post for sealing the semiconductor chip; and a plurality of solder balls adhered to a lower side of the PCB. An extrusion is formed at a upper end of the sealing post, and the sealing cap is adhered on the extrusion of the sealing post. Further, the sealing cap is adhered on the extrusion of the sealing post by a low temperature thermoplastic tape or a material similar to low temperature thermoplastic tape. In the TV-BGA package, a sealing post is adhered on the adhesive material coated on an edge of the PCB, and then a sealing cap is capped on the sealing post, so that a test vehicle is manufactured. Therefore, the TV-BGA package can be easily manufactured and is suitable to test high density and speed elements.

Claims

1. A test vehicle ball grid array package comprising:

a PCB having bonding fingers;

an adhesive material being coated on an edge of the PCB;

a sealing post being adhered on the adhesive material;

a semiconductor testing chip having a plurality of bonding pads adhered on the PCB;

a plurality of metal wires separately connecting bonding pads of the PCB to the bonding fingers of the PCB;

a sealing cap adhered on a sealing post for sealing the semiconductor chip; and

a plurality of solder balls adhered to a lower side of the PCB.

2. A test vehicle ball grid array package according to claim 1, wherein each of the sealing post and the sealing cap is made from non-conductive material.

3. A test vehicle ball grid array package according to claim 1, wherein an extrusion is formed at a upper end of the sealing post.

4. A test vehicle ball grid array package according to claim 1, wherein the sealing cap is adhered on the extrusion of the sealing post.

5. A test vehicle ball grid array package according to claim 4, wherein the sealing cap is adhered on the extrusion of the sealing post by a low temperature thermoplastic tape or a material similar to low temperature thermoplastic tape.

6. A test vehicle ball grid array package according to claim 1, wherein the semiconductor chip is a center pad-type chip or an edge pad-type chip.