Package with integrated inductor and/or capacitor
First Claim
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1. A method of attaching two wafers, the method comprising:
- providing a first wafer having a first side and a second side;
providing a second wafer having a first side and a second side;
creating at least one pit into the first side of the second wafer to define a pillar;
adapting the pillar to conduct an electric signal;
providing a contact pad on a first side of the first wafer;
aligning the first wafer and the second wafer such that the pillar corresponds to the contact pad;
attaching the first wafer to the second wafer.
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Abstract
Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
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Citations
44 Claims
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1. A method of attaching two wafers, the method comprising:
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providing a first wafer having a first side and a second side;
providing a second wafer having a first side and a second side;
creating at least one pit into the first side of the second wafer to define a pillar;
adapting the pillar to conduct an electric signal;
providing a contact pad on a first side of the first wafer;
aligning the first wafer and the second wafer such that the pillar corresponds to the contact pad;
attaching the first wafer to the second wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A device comprising:
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a first wafer having a first side and a second side, the first wafer including an electronic component and an electrically conductive element;
a second wafer having a first side and a second side, the first side of the second wafer including at least one pit that defines at least one pillar, at least part of the pillar being adapted to be electrically conductive, wherein the second wafer includes an electronic device that is electrically coupled to the at least part of the pillar that is electrically conductive;
wherein the first wafer is attached to the second wafer such that the at least part of the pillar that is electrically conductive is electrically coupled to the electrically conductive element. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method comprising:
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providing a first wafer having a first side and a second side;
providing a second wafer having a first side and a second side;
creating at least one pit into the first side of the second wafer to define a first pillar and a second pillar;
adapting the first pillar to conduct an electrical signal;
adapting the second pillar to conduct an electrical signal;
providing an electronic device having a first lead and a second lead, the first lead coupled to the first pillar and the second lead coupled to the second pillar;
providing a first contact pad and a second contact pad on a first side of the first wafer;
aligning the first wafer and the second wafer such that the first pillar corresponds to the first contact pad and the second pillar corresponds to the second contact pad;
attaching the first wafer to the second wafer.
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31. A device comprising:
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a first wafer including a pillar formed by removing a portion of the first wafer, a first electronic device, and a perimeter;
a second wafer having a second electronic device and a perimeter, the second wafer bonded to the first wafer;
means for conducting an electronic signal from the first electronic device to the second electronic device, the means for conducting engaged with the pillar and wholly within the perimeters of both the first wafer and the second wafer.
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32. A method comprising:
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providing a first wafer having a first side and a second side;
providing a second wafer having a first side and a second side;
creating at least one pit into the first side of the second wafer to define a pillar;
adapting a first region of the pillar to conduct an electrical signal;
adapting a second region of the pillar to conduct an electrical signal, the second region not overlapping the first region;
providing an electronic device having a first lead and a second lead, the first lead coupled to the first region of the pillar and the second lead coupled to the second region of the pillar;
providing a first contact pad and a second contact pad on a first side of the first wafer; and
attaching the first wafer to the second wafer such that the first region of the pillar is electrically connected to the first contact pad and the second region of the pillar is electrically connected to the second contact pad.
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33. A method comprising:
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providing a first wafer with the circuit, the circuit including a first contact pad and a second contact pad;
providing a second wafer having a first side and a second side;
removing portions of the first side of the second wafer to define a pillar;
adapting a first region of the pillar to be electrically conductive;
adapting a second region of the pillar to be electrically conductive, the second region separate from the first region;
applying a metallization layer to the first side of the pillar, the metallization layer defining an inductive element having a first lead and a second lead;
providing an electrical connection between the first lead and the first region;
providing an electrical connection between the second lead and the second region;
attaching the first side of the second wafer to the first wafer such than an electrical connection between the first region and the first contact pad is created and an electrical connection between the second region and the second contact pad is created. - View Dependent Claims (34, 35)
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36. A device comprising:
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a wafer having a first side and a second side, the first side having an area removed to form a pit, the pit defining a pillar;
a first electrically conductive means engaging a first region of the pillar;
a second electrically conductive means engaging a second region of the pillar, wherein there is a discontinuity between the first region and the second region; and
an electronic device engaged with the wafer, the electronic device having a first lead electrically coupled to the first electrically conductive means and a second lead electrically coupled to the second electrically conductive means. - View Dependent Claims (37, 38, 39, 40)
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41. A device comprising:
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a wafer having a first side and a second side with an area of the first side removed to form a pit defining a first pillar and a second pillar;
electrically conductive means engaged with a region of the first pillar;
electrically conductive means engaged with a region of the second pillar; and
metal deposited within the pit, the metal formed to define a first portion and a second portion, the first portion and second portion electrically isolated from one another by a layer of dielectric; and
wherein the first portion is electrically coupled to the first electrically conductive means and the second portion is electrically coupled to the second electrically conductive means, the metal and the dielectric adapted to form a capacitor. - View Dependent Claims (42, 43, 44)
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Specification