Process of manufacturing optical waveguide and connection structure of optical devices

• US 20040178522A1
• Filed: 01/21/2004
• Published: 09/16/2004
• Est. Priority Date: 01/24/2003
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Mochizuki, Amane, Mune, Kazunori, Yamashita, Kenichi, Oe, Kunishige, Naitou, Ryuusuke
• Granted Patent: US 7,641,821 B2
• Time in Patent Office: Days
• US Class Current: 264/1.25
• CPC Class Codes: G02B 6/138 by using polymerisation
• CPC Class Codes: G02B 6/3801 Permanent connections, i.e. wherein fibres are kept aligned by mechanical means splices by bonding G02B6/255; fusion splices G02B6/2551
• CPC Class Codes: G02B 6/4212 the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel

Abstract

The invention provides a process of manufacturing an optical waveguide for optically connecting a plurality of optical devices, comprising the steps of: disposing a resin composition between two or more optical devices, the resin composition comprising a resin and a 1,4-dihydropyridine derivative, forming an optical path through the resin composition between the optical devices by light having a wavelength capable of inducing a structural change in the 1,4-dihydropyridine derivative, and removing the 1,4-dihydropyridine derivative from the resulting resin composition. Also disclosed is a connection structure obtained by the process.

Claims

1. A process of manufacturing an optical waveguide for optically connecting a plurality of optical devices, comprising the steps of:

disposing a resin composition between two or more optical devices, the resin composition comprising a resin and a 1,4-dihydropyridine derivative,

forming an optical path through the resin composition between the optical devices by light having a wavelength capable of inducing a structural change in the 1,4-dihydropyridine derivative, and

removing the 1,4-dihydropyridine derivative from the resulting resin composition.

2. The process according to claim 1, wherein the resin comprises at least one member selected from the group consisting of polyamic acid, polyimide and polyamide-imide.

3. The process according to claim 1, wherein the resin composition contains 0.1 to 30 parts by weight of the 1,4-dihydropyridine derivative per 100 parts by weight of the resin.

4. The process according to claim 3, wherein the resin composition contains 1 to 5 parts by weight of the 1,4-dihydropyridine derivative per 100 parts by weight of the resin.

5. The process according to claim 1, wherein the 1,4-dihydropyridine derivative comprises a compound represented by formula (I):

6. The process according to claim 5, wherein R₁ is —

H, —

CH₃ or —

(CH₂)_nCH₃, R₂ and R₃ each independently represent —

H, —

CH₃ or —

(CH₂)_nCH₃, R₄ and R₅ each independently represent —

COOR_z or —

COR_z, wherein R_z is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms and n is an integer of 1 to 4.

7. The process according to claim 5, wherein the 1,4-dihydropyridine derivative comprises at least one compound selected from the group consisting of 1-ethyl-3,5-dimethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine, 1-methyl-3,5-dimethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine, 1-propyl-3,5-dimethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine, 1-propyl-3,5-diethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine, 2,6-dimethyl-3,5-dimethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine, 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine, and 1-ethyl-2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine.

8. The process according to claim 7, wherein the 1,4-dihydropyridine derivative comprises 1-ethyl-3,5-dimethoxycarbonyl-4-(2-nitrophenyl)-1,4-dihydropyridine.

9. The process according to claim 7, wherein the 1,4-dihydropyridine derivative comprises at least one of 2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine and 1-ethyl-2,6-dimethyl-3,5-diacetyl-4-(2-nitrophenyl)-1,4-dihydropyridine.

10. The process according to claim 1, wherein the resin comprises at least one member selected from the group consisting of polyamic acids, polyimides, and polyamide-imides.

11. The process according to claim 10, wherein the resin is fluorinated.

12. A connection structure of optical devices comprising:

two or more optical devices; and

at least one optical waveguide optically connecting the optical devices, the optical waveguide being formed by a process according to any one of claims 1 to 11.