Circuit board assembly and flat coil

• US 20040178876A1
• Filed: 02/02/2004
• Published: 09/16/2004
• Est. Priority Date: 03/11/2003
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Fujitsu Hitachi Plasma Display Limited (Hitachi, Ltd.)
• Inventors: Onozawa, Makoto, Koizumi, Haruo
• Granted Patent: US 7,061,361 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10462 Flat component oriented parallel to the PCB surface
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Abstract

A circuit board assembly has a flat coil element mounted on a circuit board so that an electric power loss is not generated even when the flat coil element is mounted to the circuit board together with a circuit part having a large heat sink. A module mounted on the circuit board has an electronic circuit device and a heat radiator attached to the electronic circuit device. The heat radiator has an extending part protruding from the electronic circuit device and extending parallel to a surface of the circuit board. A coil mounting area provided with no pattern wire is formed in a part of the circuit board facing the extending part. The flat coil element is mounted parallel to the circuit board in a state where a coil part of the flat coil element faces the coil mounting area.

Claims

1. A circuit board assembly comprising:

a circuit board;

a module mounted on the circuit board and having an electronic circuit device and a heat radiator attached to the electronic circuit device; and

a flat coil element,

wherein said heat radiator has an extending part protruding from said electronic circuit device and extending parallel to a surface of said circuit board;

a coil mounting area provided with no pattern wire is formed in a part of said circuit board facing the extending part; and

said flat coil element is mounted parallel to said circuit board in a state where a coil part of said flat coil element faces said coil mounting area.

2. The circuit board assembly as claimed in claim 1, wherein said coil mounting area is an opening formed by removing a part of said circuit board.

3. The circuit board assembly as claimed in claim 1, wherein a distance between said extending part of said heat radiator and said flat coil element is set to a distance at which no eddy current is generated within said extending part due to a magnetic field generated by said flat coil element.

4. The circuit board assembly as claimed in claim 1, wherein an opening is provided in a portion of said extending part of said heat radiator, the portion facing said flat coil element.

5. The circuit board assembly as claimed in claim 1, wherein said module is a power module for driving a plasma display, and said flat coil element provides an inductance used for recovering an electric power of the plasma display.

6. The circuit board assembly as claimed in claim 5, wherein said extending part of said heat radiator extends on an output side of said power module.

7. A flat coil comprising:

a coil part formed by a pattern wire provided on each layer of a multi-layer substrate,

wherein the coil part is electrically connected to a corresponding terminal by a conductive part extending in a direction of thickness of said multi-layer substrate, and the coil part of each layer is configured and arranged to be electrically connectable to the coil part of another layer by short-circuiting the terminals.

8. A flat coil comprising:

a coil part formed on each of an uppermost layer and a lowermost layer of a multi-layer substrate,

wherein the coil part is electrically connected to a corresponding terminal by a conductive part extending in a direction of thickness of said multi-layer substrate, and the coil part of each layer is configured and arranged to be electrically connectable to the coil part of another layer by short-circuiting the terminals.

9. A circuit board assembly comprising:

a circuit board;

a module mounted on the circuit board and having an electronic circuit device and a heat radiator attached to the electronic circuit device; and

a flat coil comprising a coil part formed by a pattern wire provided on each layer of a multi-layer substrate

wherein the coil part is electrically connected to a corresponding terminal by a conductive part extending in a direction of thickness of said multi-layer substrate, and the coil part of each layer is configured and arranged to be electrically connectable to the coil part of another layer by short-circuiting the terminals, and

wherein said heat radiator has an extending part protruding from said electronic circuit device and extending parallel to a surface of said circuit board, and said flat coil is mounted in an area facing said extending part of said heat radiator.

10. The circuit board assembly as claimed in claim 9, wherein an opening is provided in a portion of said extending part of said heat radiator, the portion facing said flat coil element.

11. A circuit board assembly comprising:

a circuit board;

a module mounted on the circuit board and having an electronic circuit device and a heat radiator attached to the electronic circuit device; and

a flat coil comprising a coil part formed on each of an uppermost layer and a lowermost layer of a multi-layer substrate,

wherein the coil part is electrically connected to a corresponding terminal by a conductive part extending in a direction of thickness of said multi-layer substrate, and the coil part of each layer is configured and arranged to be electrically connectable to the coil part of another layer by short-circuiting the terminals, and

wherein said heat radiator has an extending part protruding from said electronic circuit device and extending parallel to a surface of said circuit board, and said flat coil is mounted in an area facing said extending part of said heat radiator.

12. The circuit board assembly as claimed in claim 11, wherein an opening is provided in a portion of said extending part of said heat radiator, the portion facing said flat coil element.