Mold die and method for manufacturing semiconductor device using the same

• US 20040180475A1
• Filed: 03/11/2004
• Published: 09/16/2004
• Est. Priority Date: 03/11/2003
• Status: Active Grant

• Current Assignee: Shindo Co., Ltd.
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Inventors: Okamoto, Akihiro, Shibata, Akiji, Komiya, Kazumoto, Shimazaki, Yosuke
• Granted Patent: US 7,355,278 B2
• Time in Patent Office: Days
• US Class Current: 438/127
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

An object of the present invention is to provide a technology that can seal the opening of the interposer by transfer mold with the leak of the insulating resin from the above-described opening prevented. A mold die comprising a first die having a recess in a predetermined form and a second flat die, the above-described mold die being for disposing the above-described first die on a surface of a wiring board which has a plurality of openings and bears a semiconductor chip via an elastic material, which surface bears the above-described semiconductor chip, and for disposing the above-described second die on a back of the above-described surface of the above-described wiring board which bears the above-described semiconductor chip, and for sealing with an insulating resin a periphery of the above-described semiconductor chip and at least one of the above-described openings of the above-described wiring board, wherein the above-described second die comprises a protrusion around an area overlapping the above-described opening sealed with the above-described insulating resin.

Claims

1. A mold die comprising a first die having a recess in a predetermined form and a second flat die, said mold die being for disposing said first die on a surface of a wiring board which has a plurality of openings and bears a semiconductor chip via an elastic material, which surface bears said semiconductor chip, and for disposing said second die on a back of said surface of said wiring board which bears said semiconductor chip, and for sealing with an insulating resin a periphery of said semiconductor chip and at least one of said openings of said wiring board, wherein

said second die comprises a protrusion around an area overlapping said opening sealed with said insulating resin.

2. A method for manufacturing a semiconductor device by sealing, by transfer mold using a die, a semiconductor chip borne on a wiring board via an elastic material, which board includes an insulating substrate with a plurality of openings thereon on which a conductive pattern is formed, and by sealing at least one of said openings, wherein

a die having a protrusion around an area overlapping said sealed opening is used for a back of the surface of said wiring board which bears said semiconductor chip.