Adaptive defect based testing
First Claim
1. A method of testing integrated circuits, the method comprising the steps of:
- performing on each of the integrated circuits a first test at a first level of testing at a preceding testing step in a fabrication cycle of the integrated circuits to produce first test results associated with a first characteristic of the integrated circuits, recording the first test results with associated integrated circuit identification information, logically subdividing the integrated circuits into bins based at least in part on the associated integrated circuit identification information, calculating a defectivity value for each bin of subdivided integrated circuits based at least in part on the first test results recorded with the associated integrated circuit identification information, and performing on the integrated circuits within each of the bins a second test at a second level of testing at a succeeding testing step in the fabrication cycle of the integrated circuits to produce second test results associated with a second characteristic of the integrated circuits, where the second characteristic is related to the first characteristic and the second level of testing is varied from bin to bin based at least in part on the defectivity value for the bin being tested.
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Accused Products
Abstract
A method of testing integrated circuits. Each of the integrated circuits is tested with a first test at a first level of testing at a preceding testing step in a fabrication cycle of the integrated circuits to produce first test results associated with a first characteristic of the integrated circuits. The first test results are recorded with associated integrated circuit identification information. The integrated circuits are logically subdivided into bins based at least in part on the associated integrated circuit identification information. A defectivity value is calculated for each bin of subdivided integrated circuits based at least in part on the first test results recorded with the associated integrated circuit identification information. The integrated circuits within each of the bins are tested with a second test at a second level of testing at a succeeding testing step in the fabrication cycle of the integrated circuits to produce second test results associated with a second characteristic of the integrated circuits. The second characteristic is related to the first characteristic and the second level of testing is varied from bin to bin based at least in part on the defectivity value for the bin being tested.
14 Citations
20 Claims
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1. A method of testing integrated circuits, the method comprising the steps of:
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performing on each of the integrated circuits a first test at a first level of testing at a preceding testing step in a fabrication cycle of the integrated circuits to produce first test results associated with a first characteristic of the integrated circuits, recording the first test results with associated integrated circuit identification information, logically subdividing the integrated circuits into bins based at least in part on the associated integrated circuit identification information, calculating a defectivity value for each bin of subdivided integrated circuits based at least in part on the first test results recorded with the associated integrated circuit identification information, and performing on the integrated circuits within each of the bins a second test at a second level of testing at a succeeding testing step in the fabrication cycle of the integrated circuits to produce second test results associated with a second characteristic of the integrated circuits, where the second characteristic is related to the first characteristic and the second level of testing is varied from bin to bin based at least in part on the defectivity value for the bin being tested. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification