Multi-fixture assembly of cutting tools
First Claim
1. A method for assembling a cutting tool, comprising the steps of:
- executing a first positioning step comprising positioning a wafer on a first fixture, wherein said wafer comprises a first blade;
mounting a first blade handle on said first blade while said wafer is on said first fixture;
removing said wafer from said first fixture after said mounting step;
executing a second positioning step comprising positioning said wafer on a second fixture;
separating said first blade from a remainder of said wafer while said wafer is on said second fixture, wherein said separating step is executed after said mounting step.
1 Assignment
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Accused Products
Abstract
A method for providing a cutting tool (20) is disclosed. Multiple cutting blades (56) are fabricated from a wafer (130). This wafer (130) is disposed on a blade handle mounting fixture (224) such that a blade handle (24) may be mounted on each of the individual blades (56). A cutting edge (80) of each blade (56) is maintained in spaced relation to the fixture (224) as these blade handles (24) are being mounted. Thereafter, the wafer (130) is transferred to a blade separation fixture (300). Each blade 56 is suspended above the fixture (300). An appropriate force is transmitted to the individual blades (56) to separate the same from the wafer (130). Separation preferably occurs before the blade (56) contacts the fixture (300). Thereafter, the blade (56) in effect pivots into an inclined position where its cutting edge (80) project at least generally upwardly. Preferably, at no time does the cutting edge (80) of any blade (56) contact either the blade handle mounting fixture (224) or the blade separation fixture (300).
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Citations
58 Claims
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1. A method for assembling a cutting tool, comprising the steps of:
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executing a first positioning step comprising positioning a wafer on a first fixture, wherein said wafer comprises a first blade;
mounting a first blade handle on said first blade while said wafer is on said first fixture;
removing said wafer from said first fixture after said mounting step;
executing a second positioning step comprising positioning said wafer on a second fixture;
separating said first blade from a remainder of said wafer while said wafer is on said second fixture, wherein said separating step is executed after said mounting step. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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Specification