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Cooling of electronics by electrically conducting fluids

  • US 20040182088A1
  • Filed: 01/30/2004
  • Published: 09/23/2004
  • Est. Priority Date: 12/06/2002
  • Status: Active Grant
First Claim
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1. A heat spreader for spreading heat generated by high power density devices, the heat spreader comprising:

  • a. at least one cooling chamber containing liquid metal, the at least one cooling chamber allowing the liquid metal to come in direct contact with the high power density device; and

    b. electromagnetic pump means for circulating the liquid metal in the at least one cooling chamber, the liquid metal circulating in the at least one cooling chamber, the circulation spreading the heat generated by high power density devices over the heat spreader.

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