IC chip package
First Claim
1. An IC chip package comprising:
- a substrate having a top side, a bottom side, and a plurality of conductive pads arranged on the top side;
a chip fixedly mounted on the top side of said substrate and having a plurality of conductive pads;
a plurality of bonding wires respectively electrically connected between the conductive pads of said substrate and the conductive pads of said chip;
adhesive means provided on the top side of said substrate around the border thereof;
a cover adapted for covering said substrate; and
a spacer connected between said substrate and said cover to keep said cover from said substrate at a distance, wherein said spacer comprises at least two columns respectively fixedly connected between said substrate and said cover.
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Abstract
An IC chip package is constructed to include a substrate, a chip, adhesive means, a cover, and a spacer. The substrate has a top side, a bottom side, and a plurality of conductive pads at the top side. The chip is fixedly mounted in the top side of the substrate, having a plurality of conductive pads respectively electrically connected to the conductive pads of substrate by respective bonding wires. The adhesive means is provided at the top side of the substrate around the border area. The spacer is connected between the substrate and the cover to keep the cover from the substrate at a distance. The spacer has at least two columns fixedly connected between the substrate and the cover.
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Citations
19 Claims
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1. An IC chip package comprising:
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a substrate having a top side, a bottom side, and a plurality of conductive pads arranged on the top side;
a chip fixedly mounted on the top side of said substrate and having a plurality of conductive pads;
a plurality of bonding wires respectively electrically connected between the conductive pads of said substrate and the conductive pads of said chip;
adhesive means provided on the top side of said substrate around the border thereof;
a cover adapted for covering said substrate; and
a spacer connected between said substrate and said cover to keep said cover from said substrate at a distance, wherein said spacer comprises at least two columns respectively fixedly connected between said substrate and said cover. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification