Apparatus incorporating small-feature-size and large-feature-size components and method for making same
First Claim
Patent Images
1. An apparatus comprising:
- a strap including a substrate having an integrated circuit contained therein, the integrated circuit coupling to a first conductor disposed on top of the substrate the first conductor being made of a thermosetting material or a thermoplastic material; and
a large-scale component having a second conductor, the second conductor being electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit, the large-scale component including a second substrate.
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Abstract
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
147 Citations
57 Claims
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1. An apparatus comprising:
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a strap including a substrate having an integrated circuit contained therein, the integrated circuit coupling to a first conductor disposed on top of the substrate the first conductor being made of a thermosetting material or a thermoplastic material; and
a large-scale component having a second conductor, the second conductor being electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit, the large-scale component including a second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method comprising:
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attaching a first conductor of a first substrate containing a functional block to a second conductor of a large-scale component, the functional block being embedded in a first substrate and being electrically connected to the first conductor, and the large-scale component being formed on a second substrate;
the first conductor being attached to the second conductor using one of thermosonic bonding and thermocompression bonding;
each of the first conductor and the second conductor being independently made out of any one of a metal, a thermoplastic material, and a thermosetting material. - View Dependent Claims (26, 27, 28)
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29. A method comprising:
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attaching a first conductor to an integrated circuit embedded in a first substrate, the first conductor electrically connected to the integrated circuit; and
attaching a large-scale component to the first conductor, the large-scale component electrically connected to the first conductor, and the large-scale component formed on a second substrate. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A method comprising:
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embedding an integrated circuit into a first substrate and disposing a first conductor on the first substrate, the integrated circuit electrically connected to the first conductor, the first conductor being made of a thermosetting material or a thermoplastic material; and
electrically coupling a large-scale component having a second conductor to the integrated circuit, the second conductor being electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit, the large-scale component including a second substrate. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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Specification