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Assembly of semiconductor device, interposer and substrate

  • US 20040184219A1
  • Filed: 03/17/2004
  • Published: 09/23/2004
  • Est. Priority Date: 03/19/2003
  • Status: Active Grant
First Claim
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1. A capacitor comprising:

  • an approximately plate-shaped capacitor main body having a first surface on which a semiconductor device having surface-connecting terminals is to be mounted and a second surface; and

    a plurality of electrically conductive vias penetrating the capacitor main body between the first and second surfaces for connection with the surface-connecting terminals.

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