Acoustic transducer module

• US 20040184632A1
• Filed: 02/26/2004
• Published: 09/23/2004
• Est. Priority Date: 02/28/2003
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Minervini, Anthony D.
• Granted Patent: US 7,501,703 B2
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04R 1/028 associated with devices performing functions other than acoustics, e.g. electric candles
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2499/11 Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Abstract

A module (100, 200, 300, 400, 500, 600) may be electrically connected to a PCB (18) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16) of the device (14). The module includes a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610) having a connecting surface (114, 214, 314, 414, 514, 614) disposed within the housing (102, 202, 302, 402, 502, 602), and at least one acoustic port (124, 224, 324, 424, 524, 624) formed on a surface of the housing (102, 202, 302, 402, 502, 602). The module (100, 200, 300, 400, 500, 600) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610). The acoustic port (124, 224, 324, 424, 524, 624) may include a layer of an environmental barrier (450, 550).

Claims

1. An acoustic transducer module comprising:

a housing;

a surface mountable acoustic transducer disposed within the housing, the surface mountable acoustic transducer having a surface for electrically coupling the surface mounted acoustic transducer to a printed circuit board, the surface being exposed externally of the housing; and

at least one acoustic pathway coupling the surface mountable acoustic transducer to an exterior surface of the housing.

2. The acoustic transducer module of claim 1, wherein the surface mountable acoustic transducer is received within a cavity formed within the housing and secured therein.

3. The acoustic transducer module of claim 2, wherein the surface mountable acoustic transducer is secured by one of:

mechanical fasteners, friction and mutually engaging mechanical element.

4. The acoustic transducer module of claim 2, wherein the surface mountable acoustic transducer is secured by bonding.

5. The acoustic transducer module of claim 1, wherein the surface mountable acoustic transducer is in situ molded within the housing.

6. The acoustic transducer module of claim 1, wherein the housing comprises a first housing member and a second housing member.

7. The acoustic transducer module of claim 6, wherein the first housing member comprises an inner housing layer and the second housing member comprises an outer housing layer.

8. The acoustic transducer module of claim 7, comprising an intermediate layer disposed between the first housing layer and the second housing layer.

9. The acoustic transducer module of claim 8, wherein the first housing layer and the second housing layer are each non-conductive and the intermediate layer comprises a conductive layer.

10. The acoustic transducer module of claim 1, comprising a barrier disposed within the acoustic pathway.

11. The acoustic transducer module of claim 10, wherein the barrier comprises one of polymeric material film and a sintered metal.

12. The acoustic transducer module of claim 1, wherein the housing comprises a retaining structure adjacent the connecting surface, the retaining structure sized to receive an extension portion of a printed circuit board of an electronic device.

13. The acoustic transducer module of claim 1, wherein the housing comprises a mounting structure, the mounting structure configured to engage a complimentary mounting structure formed on an electronic device for securing the acoustic transducer module to the electronic device.

14. The acoustic transducer module of claim 1, comprising a secondary mounting structure, the secondary mounting structure configured to electrically couple the surface mounted acoustic transducer to an electronic device.

15. The acoustic transducer module of claim 1, wherein the surface mounted acoustic transducer comprises a miniature silicon condenser microphone.

16. The acoustic transducer module of claim 1, wherein an outer surface of the housing is aesthetically similar to an outer surface of an electronic device to which the acoustic transducer module is to be coupled.

17. An electronic device comprising:

a housing;

a printed circuit board secured within the housing;

an acoustic transducer housing;

a surface mounted acoustic transducer disposed within the acoustic transducer housing, the surface mounted acoustic transducer having a surface for electrically coupling the surface mounted acoustic transducer to the printed circuit board, the surface being exposed externally of the housing; and

at least one acoustic pathway coupling the surface mounted acoustic transducer to an exterior surface of the housing;

the acoustic transducer housing being secured to the housing and the surface being in contact with the printed circuit board to electrically couple the surface mounted acoustic transducer to the printed circuit board.

18. The electronic device of claim 17, wherein the electronic device comprises one of a cellular telephone, a personal digital assistant, a pager, a laptop computer and a portable web browser.

19. The electronic device of claim 17, wherein the acoustic transducer housing is one of bonded to, mechanically secured to and in situ molded within the housing.

20. The electronic device of claim 17, wherein the acoustic transducer housing has a surface forming a portion of a surface of the housing.