Electromagnetic interference shielding of electrical cables and connectors

• US 20040187311A1
• Filed: 10/21/2003
• Published: 09/30/2004
• Est. Priority Date: 04/17/2000
• Status: Active Grant

• Current Assignee: Deep Coat, LLC
• Original Assignee: Shielding For Electronics Incorporated
• Inventors: Ortiz, Jesus Al, Arnold, Rocky R.
• Granted Patent: US 7,102,082 B2
• Time in Patent Office: Days
• US Class Current: 29/857
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49171 with encapsulating
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material
• CPC Class Codes: Y10T 29/4922 with molding of insulation
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

The present invention provides cables having a body that is surrounded by a vacuum metallized layer. The metallized layer can be grounded with a metallized thermoform connector to prevent the release or impingement of harmful EMI radiation. Optionally, an insulating top coating can be disposed over the metallized layer over the cable body.

Claims

1. A method of shielding and grounding a cable, the method comprising:

providing conductive leads encapsulated within a dielectric layer;

applying a metallized layer around the dielectric layer; and

coupling a metallized thermoform connector to the metallized layer, wherein the metallized thermoform can be electrically coupled to a grounded housing.

2. The method of claim 1 further comprising covering the metallized layer with an insulating layer, wherein a portion of the metallized layer is exposed through the insulating layer so as to allow the metallized thermoform connector to electrically contact the metallized layer.

3. The method of claim 1 wherein applying comprises thermally vaporizing the metallized layer onto the dielectric.

4. The method of claim 3 wherein thermally vaporizing comprises depositing the metallized layer having a thickness between approximately one-tenth micron and twelve microns.

5. The method of claim 1 further comprising contacting at least one of the conductive leads with the metallized layer.

6. The method of claim 1 wherein the metallized thermoform can be removably attached over a connector pin assembly that attaches the conductive leads to the housing.

7. The method of claim 1 wherein the metallized thermoform is metallized on at least one of an inside surface and an outside surface.

8. The method of claim 1 wherein coupling comprises snap fitting or interference fitting the metallized thermoform over the metallized layer.

9. The method of claim 1 wherein the metallized thermoform comprises bumps to create contact between metallized layer and the thermoform.

10. The method of claim 9 wherein the bumps are spaced no farther than one half a wavelength of the EMI radiation and have a height of no larger than one half a wavelength of the EMI radiation.

11. A shielded cable comprising:

a cable body comprising electrical conductors disposed within an insulating substrate;

a vacuum metallized shielding layer disposed over the insulating substrate, and

a metallized thermoform connector coupled to an end portion of the cable body and electrically coupled to the vacuum metallized layer, wherein the connector can be electrically coupled to a grounded housing so as to ground the shielding layer and connector.

12. The cable of claim 11 further comprising an insulating top coating disposed over the vacuum metallized layer to insulate the vacuum metallized layer.

13. The cable of claim 12 wherein the insulating top layer extends to a point short of the connector such that the connector is electrically coupled to the metallized layer.

14. The cable of claim 11 wherein the vacuum metallized layer has a thickness between approximately one-half micron to twelve microns.

15. The cable of claim 11 wherein the metallized thermoform is coupled to an outsize surface of a nonconductive connector.

16. The cable of claim 11 wherein the connector further comprises spaced protrusions, wherein the connector is electrically coupled to the metallized layer with the spaced protrusions.

17. The cable of claim 16 wherein the spaced protrusions have a height and spacing between an adjacent protrusion that is no larger than one-half a wavelength of a released radiation.

18. A method of shielding a cable from EMI and RFI radiation, the method comprising:

providing conductive leads disposed within a dielectric;

thermally vaporizing a metallized layer around the dielectric; and

grounding the metallized layer to a grounded housing.

19. The method of claim 18 wherein grounding comprises electrically coupling the metallized layer to the grounded housing with a metallized thermoform connection assembly.

20. The method of claim 18 wherein thermally vaporizing comprises maintaining the temperature of the dielectric below approximately 150°

F.

21. The method of claim 18 wherein thermal vaporizing comprises creating a substantial uniform metallized layer on the dielectric.

22. A shielded cable comprising:

a conductive lead encapsulated within a dielectric;

a polymer layer surrounding the dielectric;

a metallized layer surrounding the polymer layer; and

a insulative coating disposed around the metallized layer.

23. The shielded cable of claim 22 wherein the metallized layer is thermally evaporated over the polymer layer so as to create a substantially uniform thickness.

24. The shielded cable of claim 22 further comprising a base coating disposed between the metallized layer and the polymer layer, wherein the base coating improves adherence of the metallized layer to the polymer layer.

25. The shielded cable of claim 22 wherein the polymer layer comprises a thermoformable material.

26. The shielded cable of claim 22 further comprising an electrically conductive connector that is electrically coupled to the metallized layer, wherein the connector can be coupled to ground.

27. The shielded cable of claim 27 wherein the electrically conductive connector comprises a metallized thermoform.

28. The shielded cable of claim 27 wherein the metallized thermoform comprises a first body and a second body.

29. A method of shielding a cable, the method comprising:

providing a conductive lead disposed within a dielectric;

encapsulating the dielectric with a polymer coating;

coupling a metallized layer around the polymer coating; and

insulating the metallized layer.

30. The method of claim 29 wherein coupling comprises applying a base coating to the polymer to increase adhesion of the metallized layer.

31. The method of claim 29 wherein coupling comprises thermally vaporizing the metallized layer onto the dielectric.

32. The method of claim 29 further comprising grounding the metallized layer to a ground with a metallized thermoform.

33. A cable shield for shielding a cable body, the shield comprising:

a thermoform body comprising an inner surface and outer surface, the thermoform body sized and shaped to surround the cable; and

a metal layer disposed along one of the inner surface and outer surface.

34. The cable shield of claim 33 further wherein the thermoform body comprises a first body and a second body.

35. The cable shield of claim 34 wherein the first body and second body are coupled together with a clamp.

36. The cable shield of claim 33 wherein the thermoform body comprises at least one of ribs, cutouts, and corrugation to facilitate flexing of the thermoform body.

37. The cable shield of claim 33 wherein the metallized layer is disposed along the outer surface of the thermoform body, the shield further comprising an insulating layer disposed over the metal layer.

38. The cable shield of claim 33 wherein the metallized thermoform comprises an integral connector at an end of the thermoform body, wherein the integral connector can shield a connector pin assembly of the cable.

39. A method of shielding a cable, the method comprising:

providing a cable body having a body and at least one connector pin assembly;

placing a metallized thermoform around the cable body and connector pin assembly;

grounding the metallized thermoform.

40. The method of claim 39 wherein placing comprises snap fitting the metallized thermoform around the cable body.