Substrate support having temperature controlled substrate support surface
First Claim
1. A substrate support useful in a plasma processing apparatus, comprising:
- a body having a support surface for supporting a substrate in a reaction chamber of a plasma processing apparatus;
a first liquid flow passage extending through a first portion of the body so as to provide temperature control of a first portion of the support surface;
a second liquid flow passage extending through a second portion of the body so as to provide temperature control of a second portion of the support surface;
a first inlet in fluid communication with the first liquid flow passage;
a second inlet in fluid communication with the second liquid flow passage;
a first outlet in fluid communication with the first liquid flow passage; and
a second outlet in fluid communication with the second liquid flow passage.
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Accused Products
Abstract
A substrate support having a temperature controlled substrate support surface includes a liquid supply system having at least one liquid source and a plurality of liquid flow passages. The liquid supply system can include valves to control the distribution of liquid to the liquid flow passages. The liquid supply system also can include a controller to control its operation. Liquid can be distributed through the liquid flow passages in various patterns. The substrate support can also include a heat transfer gas supply system, which supplies a heat transfer gas between the substrate support surface and a substrate supported on the substrate support surface.
246 Citations
43 Claims
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1. A substrate support useful in a plasma processing apparatus, comprising:
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a body having a support surface for supporting a substrate in a reaction chamber of a plasma processing apparatus;
a first liquid flow passage extending through a first portion of the body so as to provide temperature control of a first portion of the support surface;
a second liquid flow passage extending through a second portion of the body so as to provide temperature control of a second portion of the support surface;
a first inlet in fluid communication with the first liquid flow passage;
a second inlet in fluid communication with the second liquid flow passage;
a first outlet in fluid communication with the first liquid flow passage; and
a second outlet in fluid communication with the second liquid flow passage. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A substrate support useful for a plasma processing apparatus, comprising:
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a body having a support surface for supporting a substrate in a reaction chamber of a plasma processing apparatus;
a plurality of liquid flow passages provided in the body, each liquid flow passage having a supply line and a return line; and
a liquid supply system including at least one liquid source in fluid communication with the supply line and the return line of the liquid flow passages, the liquid supply system being operable to supply a liquid from the at least one liquid source to one or more selected liquid flow passages to control the temperature at one or more selected portions of the support surface. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of processing a semiconductor substrate in a plasma processing apparatus, comprising:
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supporting a semiconductor substrate on a support surface of a support body in a reaction chamber of a plasma processing apparatus;
circulating liquid in a first liquid flow passage extending through a first portion of the support body so as to provide temperature control of the first portion of the support surface; and
circulating liquid in a second liquid flow passage extending through a second portion of the support body so as to provide temperature control of the second portion of the support surface;
wherein the liquid is circulated in the first liquid flow passage and second liquid flow passage by supplying liquid to a first inlet in fluid communication with the first liquid flow passage, flowing liquid out of a first outlet in fluid communication with the first liquid flow passage, supplying liquid to a second inlet in fluid communication with the second liquid flow passage, and flowing liquid out of a second outlet in fluid communication with the second liquid flow passage. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification