HERMETIC SEAL AND CONTROLLED IMPEDANCE RF CONNECTIONS FOR A LIQUID METAL MICRO SWITCH

• US 20040188234A1
• Filed: 03/31/2003
• Published: 09/30/2004
• Est. Priority Date: 03/31/2003
• Status: Active Grant

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Wong, Marvin Glenn, Dove, Lewis R.
• Granted Patent: US 6,825,429 B2
• Time in Patent Office: Days
• US Class Current: 200/302.1
• CPC Class Codes: H01H 2029/008 using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
• CPC Class Codes: H01H 29/28 with level of surface of contact liquid displaced by fluid pressure

Abstract

One or more LIMMS devices on a substrate, possibly having same-surface signal conductors, are hermetically sealed by either: (a) Enclosing each entire LIMMS device beneath a common or respective outer cover that is separate from the LIMMS device(s) and impervious to contaminants; or (b) Fabricating each LIMMS device such that its individual cover block (which is already a component of the LIMMS and is not a separate outer cover) can be hermetically sealed against the substrate. Each case must limit the effects of the hermetic seal upon impedances. In case (a) the substrate is covered with a layer of dielectric material matching the ribbon-like footprint of the perimeter of the separate outer cover. In case (b), the entire (solid) footprint of the LIMMS cover block on the substrate receives a layer of dielectric material, which may itself then be covered, save for near its perimeter, with suitable adhesive. In case (a) the outer cover may be soldered to the perimeter footprint. In case (b) the cover block may be soldered to dielectric layer. In another embodiment for cases (a) and (b) glass frit is used in place of solder. Disturbances to signal line impedance may be compensated by changes in signal conductor width. The layer of suitable dielectric material may be a thin sheet or gasket of previously patterned ceramic material, or it may be formed by the application of a thick film paste. Suitable thick film dielectric materials deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.

Claims

1. An electronic assembly comprising:

a substrate having a first surface;

a layer of dielectric material having first and second surfaces whose shapes generally match that of a mounting footprint of a device to be mounted on the substrate, the first surface of the layer of dielectric material adhering to the first surface of the substrate at a location thereof where the device is to be mounted;

a LIMMS device mounted on the substrate and having a mounting surface adhering to the second surface of the layer of dielectric material; and

a fillet of hermetic sealing material disposed against both a perimeter of the mounting surface of the LIMMS device and a region of the second surface of the dielectric layer proximate the perimeter of the mounting surface of the LIMMS device.

2. An electronic assembly as in claim 1 further comprising at least one conductor that adheres to the first surface of the substrate and that passes under the layer of dielectric material.

3. An electronic assembly as in claim 1 further comprising respective layers of metal deposited on the perimeter of the mounting surface of the LIMMS device and on the region of the second surface of the dielectric layer proximate the perimeter of the mounting surface of the LIMMS device and wherein the fillet of hermetic sealing material is of solder.

4. An electronic assembly as in claim 3 wherein the width of the at least one conductor is altered within a location proximate where it passes under the fillet of hermetic sealing material.

5. An electronic assembly as in claim 1 wherein the fillet of hermetic sealing material is of glass frit.

6. An electronic assembly as in claim 1 wherein the LIMMS device includes a cover block having in the mounting surface of the LIMMS device internal recesses that form channels therein and wherein the layer of dielectric material is of borosilicate glass.

7. An electronic assembly as in claim 6 wherein the borosilicate glass is applied according to thick film techniques.

8. An electronic assembly as in claim 7 wherein the borosilicate glass is patterned to match the channels in the mounting surface of the LIMMS device.

9. An electronic assembly as in claim 1 wherein the LIMMS device includes a cover block having in the mounting surface of the LIMMS device internal recesses that form channels therein and wherein the layer of dielectric material further comprises a ceramic gasket patterned to match the channels in the mounting surface of the LIMMS device and a matching patterned layer of adhesive material disposed between the ceramic gasket and the first surface of the substrate.

10. An electronic assembly as in claim 9 wherein the ceramic gasket is hermetically sealed to the first surface of the substrate by an additional hermetic seal.

11. An electronic assembly comprising:

a substrate having a first surface;

a LIMMS device mounted on the substrate;

an outer cover having a recess therein for enclosing the LIMMS device and also having a mounting perimeter surface;

a ribbon of dielectric material having first and second surfaces whose shapes generally match that of the mounting perimeter surface of the outer cover, the first surface of the ribbon dielectric material adhering to the first surface of the substrate at a location thereof that both surrounds the LIMMS device and that encompasses where the outer cover is to enclose the LIMMS device;

a fillet of hermetic sealing material disposed against both the mounting perimeter surface of the outer cover and a region of the second surface of the ribbon of dielectric material proximate the mounting perimeter surface of the outer cover.

12. An electronic assembly as in claim 11 further comprising at least one conductor that adheres to the first surface of the substrate and that passes under the ribbon of dielectric material.

13. An electronic assembly as in claim 12 wherein the width of the at least one conductor is altered within a location proximate where it passes under the ribbon of dielectric material.

14. An electronic assembly as in claim 11 wherein the second surface of the ribbon of dielectric material includes a layer of metal and further wherein the fillet of hermetic sealing material is solder.

15. An electronic assembly as in claim 11 the fillet of hermetic sealing material is a glass frit.

16. An electronic assembly as in claim 11 wherein the ribbon of dielectric material is of borosilicate glass.

17. An electronic assembly as in claim 16 wherein the borosilicate glass is applied according to thick film techniques.

18. An electronic assembly as in claim 11 wherein the ribbon of dielectric is a ceramic gasket and wherein the electronic assembly further comprises a layer of adhesive attaching the ceramic gasket to the first surface of the surface of the substrate and an additional fillet of hermetic sealing material disposed against both the ceramic gasket and the first surface of the substrate.