Methods of forming medical devices

• US 20040188261A1
• Filed: 03/27/2003
• Published: 09/30/2004
• Est. Priority Date: 03/27/2003
• Status: Active Grant

• Current Assignee: Boston Scientific Scimed, Inc. (Boston Scientific Corporation)
• Original Assignee: Scimed Life Systems Incorporated (Boston Scientific Corporation)
• Inventors: Chandrasekaran, Verivada, Monni, Vittorino, Voraphet, Outhay
• Granted Patent: US 6,960,370 B2
• Time in Patent Office: Days
• US Class Current: 205/103
• CPC Class Codes: C25D 5/18 Electroplating using modulated, pulsed or reversing current
• CPC Class Codes: C25D 5/36 of iron or steel
• CPC Class Codes: C25D 5/38 of refractory metals or nickel

Abstract

Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxes. Medical devices can be assembled by soldering together plated materials. Oxidizable materials can be plated with radiopaque materials to yield medical devices that are more visible to fluoroscopy.

Claims

1. A method of plating a medical device, the medical device comprising an oxidizable substrate, the method comprising:

cleaning the substrate with a cleaning and etching solution;

activating the substrate with a concentrated aqueous solution of ammonium bifluoride;

rinsing the substrate with a dilute aqueous solution of ammonium bifluoride; and

plating the substrate with a plating material.

2. The method of claim 1, wherein the medical device comprises one of a guidewire or a filter wire.

3. The method of claim 1, wherein the substrate comprises stainless steel.

4. The method of claim 1, wherein the substrate comprises titanium or a nickel/titanium alloy.

5. The method of claim 1, wherein activating the substrate results in any oxidized metal present on a surface of the substrate being reduced to the metal itself.

6. The method of claim 1, wherein the concentrated ammonium bifluoride solution comprises about 10 to 40 weight percent ammonium bifluoride.

7. The method of claim 1, wherein rinsing the substrate with the dilute ammonium bifluoride solution rinses excess ammonium bifluoride from the substrate but leaves sufficient ammonium bifluoride to yield temporary protection against oxidation.

8. The method of claim 1, wherein the dilute ammonium bifluoride solution comprises about 1 to 10 weight percent ammonium bifluoride.

9. The method of claim 1, wherein plating the substrate comprises electroplating.

10. The method of claim 1, wherein plating the substrate comprises reverse current electroplating.

11. The method of claim 1, wherein the plating material comprises from 60 to 70 weight percent tin and from 30 to 40 weight percent nickel.

12. The method of claim 1, wherein the plating material comprises gold.

13. The method of claim 1, wherein the cleaning and etching solution comprises sulfamic acid and hydrogen peroxide.

14. A method of forming a medical device comprising a first metal part and a second metal part, the first metal part comprising an oxidizable metal, the method comprising:

cleaning the first metal part with a cleaning and etching solution;

activating the first metal part with a concentrated aqueous solution of ammonium bifluoride;

rinsing the first metal part with a dilute aqueous solution of ammonium bifluoride;

electroplating the first metal part; and

soldering said plated first metal part to said second metal part.

15. The method of claim 14, wherein the first metal part comprises one of stainless steel, nitinol or titanium.

16. The method of claim 14, wherein the second metal part comprises one of stainless steel, nitinol or titanium.

17. The method of claim 14, wherein the concentrated ammonium bifluoride solution comprises about 25 weight percent ammonium fluoride.

18. The method of claim 14, wherein the dilute ammonium bifluoride solution comprises about 5 weight percent ammonium fluoride.

19. The method of claim 14, wherein the cleaning solution comprises a mixture of sulfamic acid and hydrogen peroxide.

20. The method of claim 14, wherein the plating material comprises about 65 weight percent tin and about 35 weight percent nickel.

21. The method of claim 14, further comprising, prior to soldering the first metal part to the second metal part, steps of:

cleaning the second metal part with the cleaning and etching solution;

activating the second metal part with the concentrated aqueous solution of ammonium bifluoride;

rinsing the second metal part with the dilute aqueous solution of ammonium bifluoride; and

electroplating the second metal part.

22. The method of claim 21, wherein the plating material comprises about 65 weight percent tin and about 35 weight percent nickel.

23. The method of claim 14, wherein the step of electroplating the first metal part comprises reverse current electroplating.

24. The method of claim 21, wherein the step of electroplating the second metal part comprises reverse current electroplating.

25. The method of claim 17, wherein soldering comprises using flux and a silver/tin solder comprising about 5 weight percent silver and about 95 weight percent tin.

26. The method of claim 17, wherein the first metal part comprises a guidewire shaft and the second metal part comprises a guidewire distal tip.

27. The method of claim 17, wherein the first metal part comprises a vena cava filter strut and the second metal part comprises a vena cava filter hub.

28. A method of forming a filter wire loop, the filter wire loop comprising a nitinol filter wire secured to a stainless steel wire, the filter wire having a first end and a second end, the method comprising steps of:

cleaning each of the first and second ends with a cleaning and etching solution;

activating each of the first and second ends with a first aqueous solution comprising about 10 to 40 weight percent ammonium bifluoride;

rinsing each of the first and second ends with a second aqueous solution comprising about 1 to 10 weight percent ammonium bifluoride;

electroplating each of the first and second ends with a plating material comprising nickel;

positioning the plated first and second ends in alignment with the stainless steel wire and soldering the plated first and second ends of the filter wire to the stainless steel wire.

29. The method of claim 28, wherein the step of positioning the plated first and second ends comprises coiling at least one of the first and second ends around the stainless steel wire.

30. The method of claim 28, wherein the first ammonium bifluoride solution comprises about 25 weight percent ammonium fluoride.

31. The method of claim 28, wherein the second ammonium bifluoride solution comprises about 5 weight percent ammonium fluoride.

32. The method of claim 28, wherein the cleaning solution comprises a mixture of sulfamic acid and hydrogen peroxide.

33. The method of claim 28, wherein the plating material comprises about 65 weight percent tin and about 35 weight percent nickel.

34. The method of claim 28, wherein the step of electroplating comprises reverse current electroplating.

35. The method of claim 28, wherein soldering comprises using flux and a silver/tin solder comprising about 5 weight percent silver and about 95 weight percent tin.

36. A method of making a medical device radiopaque, the medical device comprising an oxidizable substrate, the method comprising steps of:

cleaning the substrate with a cleaning and etching solution;

activating the substrate with a first aqueous solution comprising about 10 to 40 weight percent ammonium bifluoride;

rinsing the substrate with a second aqueous solution comprising about 1 to 10 weight percent ammonium bifluoride; and

electroplating the substrate with a radiopaque material.

37. The method of claim 36, wherein the first ammonium bifluoride solution comprises about 25 weight percent ammonium fluoride.

38. The method of claim 36, wherein the second ammonium bifluoride solution comprises about 5 weight percent ammonium fluoride.

39. The method of claim 36, wherein the cleaning solution comprises a mixture of sulfamic acid and hydrogen peroxide.

40. The method of claim 36, wherein the step of electroplating comprises reverse current electroplating.

41. The method of claim 36, wherein the radiopaque material comprises gold.

42. The method of claim 36, wherein the medical device comprises one of a nitinol stent, a nitinol guidewire, a stainless steel guidewire, or a nitinol filter wire loop.