Thin film transistor and fabrication method thereof

• US 20040188685A1
• Filed: 05/16/2003
• Published: 09/30/2004
• Est. Priority Date: 03/31/2003
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yeh, Yung-Hui, Lin, Chiung-Wei
• Application Number:
  US10/439,442
• Publication Number:
  US 20040188685A1
• Time in Patent Office: Days
• US Class Current: 257/66
• CPC Class Codes: H01L 29/66765 Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
• CPC Class Codes: H01L 29/78669 with inverted-type structure, e.g. with bottom gate
• CPC Class Codes: H01L 29/78696 characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel H01L29/78612 takes precedence; transistors having a drain offset region or a lightly doped drain [LDD] H01L29/78621
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays

Abstract

A TFT with a microcrystalline film. The channel is composed by a microcrystalline silicon layer and an amorphous silicon layer. The microcrystalline silicon layer is disposed near the gate electrode as the first channel layer, providing a current flow path in a horizontal orientation. The amorphous silicon layer is disposed away from the gate electrode as the second channel layer, providing a current flow path in a vertical orientation. Accordingly, the driving current of the transistor can be elevated due to the high conductivity of the microcrystalline silicon layer. Moreover, unnecessary current occurring when the transistor is switched off is reduced due to the high resistance of the amorphous silicon layer.

Claims

1. A thin film transistor, comprising:

a gate electrode;

a gate insulating layer over the gate electrode;

a microcrystalline semiconductor layer over the gate insulating layer;

an amorphous semiconductor layer over the microcrystalline semiconductor layer;

a source region and a drain region formed on the amorphous semiconductor layer and on opposite sides of the gate electrode respectively; and

a source electrode and a drain electrode deposited on the source and drain regions respectively.

2. The thin film transistor as claimed in claim 1, wherein patterns of the microcrystalline semiconductor layer and the amorphous semiconductor layer are identical.

3. The thin film transistor as claimed in claim 1, wherein the pattern of the amorphous semiconductor layer is identical to the patterns of the source and drain regions.

4. The thin film transistor as claimed in claim 1, wherein the pattern of a part of the amorphous semiconductor layer is identical to the pattern of the source and drain regions and the pattern of another part of the amorphous semiconductor layer is identical to the microcrystalline semiconductor layer.

5. The thin film transistor as claimed in claim 1, wherein the microcrystalline semiconductor layer comprises microcrystalline silicon and the amorphous semiconductor layer comprises amorphous silicon.

6. The thin film transistor as claimed in claim 1, wherein the source and drain regions comprise doped semiconductor layers.

7. The thin film transistor as claimed in claim 6, wherein the source and drain regions comprises a doped amorphous silicon layer or a doped microcrystalline silicon layer.

8. The thin film transistor as claimed in claim 1, wherein the drain electrode is coupled to an organic light emitting diode.

9. A thin film transistor, comprising:

a gate electrode;

a gate insulating layer over the gate electrode;

a channel layer over the gate insulating layer;

a high resistance layer over the channel layer;

a source region and a drain region formed on the high resistance layer and on opposite sides of the gate electrode respectively; and

a source electrode and a drain electrode deposited on the source and drain regions respectively.

10. The thin film transistor as claimed in claim 9, wherein the pattern of the channel layer is identical to the pattern of the high resistance layer.

11. The thin film transistor as claimed in claim 9, wherein the pattern of the high resistance layer is identical to the pattern of the source and drain regions.

12. The thin film transistor as claimed in claim 9, wherein the pattern of a part of the high resistance layer is identical to the pattern of the source and drain regions and the pattern of another part of the high resistance layer is identical to the pattern of the channel layer.

13. The thin film transistor as claimed in claim 9, wherein the channel layer comprises microcrystalline silicon and the high resistance layer comprises amorphous silicon.

14. The thin film transistor as claimed in claim 9, wherein the source and drain regions comprise a doped semiconductor layer.

15. The thin film transistor as claimed in claim 14, wherein the source and drain regions are a doped amorphous silicon layer or a doped microcrystalline silicon layer.

16. The thin film transistor as claimed in claim 9, wherein the drain electrode is coupled to an organic light emitting diode.

17. A thin film transistor, comprising:

a gate electrode;

a gate insulating layer over the gate electrode;

a first channel layer over the gate insulating layer to provide a current flow path parallel to the surface of the gate electrode;

a second channel layer over the first channel layer to provide a current flow path perpendicular to the surface of the gate electrode;

a source region and a drain region formed on the second channel layer and on opposite sides of the gate electrode respectively; and

a source electrode and a drain electrode deposited on the source and drain regions respectively.

18. The thin film transistor as claimed in claim 17, wherein the patterns of the first channel layer and the second channel layer are identical.

19. The thin film transistor as claimed in claim 17, wherein the pattern of the second channel layer is identical to the pattern of the source and drain regions.

20. The thin film transistor as claimed in claim 17, wherein the pattern of a part of the second channel layer is identical to the pattern of the source and drain regions and the pattern of another part of the second channel layer is identical to the pattern of the first channel layer.

21. The thin film transistor as claimed in claim 17, wherein the first channel layer comprises microcrystalline silicon and the second channel layer comprises amorphous silicon.

22. The thin film transistor as claimed in claim 17, wherein the source and drain regions comprise a doped semiconductor layer.

23. The thin film transistor as claimed in claim 22, wherein the source and drain regions comprise a doped amorphous silicon layer or a doped microcrystalline silicon layer.

24. The thin film transistor as claimed in claim 17, wherein the drain electrode is coupled to an organic emitting diode.

25. A method of fabricating a thin film transistor, comprising the steps of:

providing a substrate;

forming a gate electrode on the substrate;

forming a gate insulating layer over the gate electrode and the substrate;

forming a microcrystalline semiconductor layer over the gate insulating layer;

forming an amorphous semiconductor layer over the microcrystalline semiconductor layer;

forming a doped semiconductor layer over the amorphous semiconductor layer;

defining the doped semiconductor layer, the amorphous semiconductor layer, and the microcrystalline semiconductor layer to form a active area;

forming a metal layer over the doped semiconductor layer; and

defining the metal layer and the doped semiconductor layer to form a source region and a drain region on the doped semiconductor layer and a source electrode and a drain electrode on the metal layer.

26. The method as claimed in claim 25, wherein the substrate is a glass substrate or a flexible substrate.

27. The method as claimed in claim 26, wherein the substrate is a glass substrate or a flexible substrate.

28. The method as claimed in claim 25, wherein the doped semiconductor layer is a doped amorphous silicon layer or a doped microcrystalline silicon layer.

29. The method as claimed in claim 25, wherein the amorphous semiconductor layer comprises amorphous silicon and the microcrystalline semiconductor layer comprises microcrystalline silicon.

30. The method as claimed in claim 29, wherein the amorphous semiconductor layer is formed by chemical vapor deposition at about 250°

C.

31. The method as claimed in claim 29, wherein the microcrystalline semiconductor layer is formed by chemical vapor deposition at about 250°

C.

32. The method as claimed in claim 25, wherein the amorphous semiconductor layer is defined simultaneously while defining the metal layer and the doped semiconductor layer.

33. The method as claimed in claim 25, wherein an upper portion of the amorphous semiconductor layer is defined simultaneously while defining the metal layer and the doped semiconductor layer.

34. The method as claimed in claim 25, wherein the drain electrode is coupled to an organic light emitting diode.

35. The method as claimed in claim 34, wherein the organic light emitting diode is fabricated by the steps of:

forming an insulating layer over the thin film transistor composed by the gate electrode, the gate insulating layer, the microcrystalline semiconductor layer, the amorphous semiconductor layer, the source region, the drain region, the source electrode and the drain electrode;

forming a contact on the insulating layer exposing the drain electrode;

forming a pixel electrode on the insulating layer to connect with the drain electrode via the contact;

forming a light emitting layer on the pixel electrode and the insulating layer; and

forming a cathode layer on the light emitting layer.

36. The method as claimed in claim 35, wherein the pixel electrode comprises ITO, IZO, AZO or ZnO.

37. The method as claimed in claim 35, wherein the light emitting layer comprises small molecular organic light emitting material or an organic light emitting polymer for a diode.

38. The method as claimed in claim 35, wherein the cathode layer comprises Cu, Ag, Mg, Al, metals with low work function, or alloys thereof.