On die variable resistor
First Claim
Patent Images
1. An integrated circuit (IC) comprising:
- a package;
a die mounted within the package;
circuit components mounted on the die; and
a variable resistance module, mounted on the die, to implement series-parallel combinational logic with thermo-encoding to provide variable resistances to the circuit components.
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Abstract
According to one embodiment, an integrated circuit (IC) is disclosed. The IC includes a package, a die mounted within the package, circuit components mounted on the die, and a variable resistance module mounted on the die. The variable resistance module implements series-parallel combinational logic with thermo-encoding to provide variable resistances to the circuit components
9 Citations
25 Claims
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1. An integrated circuit (IC) comprising:
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a package;
a die mounted within the package;
circuit components mounted on the die; and
a variable resistance module, mounted on the die, to implement series-parallel combinational logic with thermo-encoding to provide variable resistances to the circuit components. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A computer system comprising:
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a central processing unit (CPU); and
a chipset, coupled to the CPU, having a variable resistance module, integrated on the chipset die, to implement series-parallel combinational logic with thermo-encoding to provide variable resistances to the circuit components. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A computer system comprising:
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a central processing unit (CPU);
a memory control hub (MCH); and
an input/output control hub (ICH), coupled to the MCH, having a variable resistance module, integrated on the ICH die, to implement series-parallel combinational logic with thermo-encoding to provide variable resistances to the circuit components. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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Specification