Lithographic projection apparatus using catoptrics in an optical sensor system, optical arrangement, method of measuring, and device manufacturing method

• US 20040189964A1
• Filed: 12/22/2003
• Published: 09/30/2004
• Est. Priority Date: 03/08/1999
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Hoogendam, Christiaan Alexander, Bruinsma, Anastasius Jacobus Anicetus, Vanneer, Roeland Nicolaas Maria, Nijmeijer, Gerrit Johannes
• Granted Patent: US 7,116,401 B2
• Time in Patent Office: Days
• US Class Current: 355/55
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7034 Leveling
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

A lithographic projection apparatus according to an embodiment of the invention includes a measurement system configured to determine a position of a target portion of a substrate, using at least one among an optical sensing operation and an optical detecting operation. The position is determined via an optical path that includes at least one catoptrical system arranged to have an imaging function of at least one dioptrical element.

Claims

1. A lithographic apparatus comprising:

a projection system configured to project a patterned beam of radiation onto a target portion of a substrate; and

a measurement system having at least one catoptrical system,

wherein said measurement system is configured to determine a position of the target portion in the patterned beam of radiation, using an optical path that traverses said at least one catoptrical system.

2. The lithographic projection apparatus according to claim 1, wherein said measurement system includes at least one of an optical sensor and an optical detector, and

wherein said at least one of an optical sensor and an optical detector includes said at least one catoptrical system.

3. The lithographic projection apparatus according to claim 1, wherein said at least one catoptrical system is configured to perform an imaging function of at least one dioptrical element.

4. The lithographic projection apparatus according to claim 1, wherein said at least one catoptrical system is configured to perform an imaging function of a dioptrical arrangement that includes at least one among a convex lens, a concave lens, a planoconvex lens, and a planoconcave lens.

5. The lithographic projection apparatus according to claim 1, wherein the at least one catoptrical system includes at least one among a concave mirror and a convex mirror.

6. The lithographic projection apparatus according to claim 1, wherein said measurement system is configured to determine a position of the target portion in the patterned beam of radiation in a vacuum ambient.

7. The lithographic projection apparatus according to claim 1, wherein said measurement system is configured to determine a position of the target portion in the patterned beam of radiation in a liquid ambient.

8. The lithographic projection apparatus according to claim 1, wherein said measurement system is configured to determine a position of the target portion in the patterned beam of radiation in an ambient substantially comprising at least one among nitrogen, helium, and argon.

9. A lithographic projection apparatus comprising:

a projection system configured to project a patterned beam of radiation onto a target portion of a substrate; and

a measurement system configured to determine a position of the target portion using at least one among an optical sensing operation and an optical detecting operation,

wherein the measurement system is configured to determine the position via an optical path that includes at least one catoptrical system.

10. The lithographic projection apparatus according to claim 9, wherein the catoptrical system is arranged to have an imaging function of at least one dioptrical element.

11. The lithographic projection apparatus according to claim 9, wherein said at least one catoptrical system is configured to perform an imaging function of a dioptrical arrangement that includes at least one among a convex lens, a concave lens, a planoconvex lens, and a planoconcave lens.

12. The lithographic projection apparatus according to claim 9, wherein the at least one catoptrical system includes at least one among a concave mirror and a convex mirror.

13. The lithographic projection apparatus according to claim 9, wherein said measurement system is configured to determine a position of the target portion in the patterned beam of radiation in a vacuum ambient.

14. A lithographic apparatus comprising:

a projection system configured to project a patterned beam of radiation onto a target portion of a substrate; and

a level sensor including at least one catoptrical system,

wherein the level sensor is configured to determine a height of a surface of the substrate using an optical path that includes the at least one catoptrical system.

15. The lithographic projection apparatus according to claim 14, wherein the level sensor includes a system configured to project an image onto the substrate that includes the catoptrical system.

16. The lithographic projection apparatus according to claim 14, wherein the level sensor includes a system configured to detect an image projected onto the substrate that includes the catoptrical system.

17. The lithographic projection apparatus according to claim 14, wherein the level sensor is configured to determine a height of a surface of the substrate using an optical path that includes no refractive elements.

18. The lithographic projection apparatus according to claim 17, wherein the level sensor is configured to determine a height of the surface of the substrate in a vacuum ambient.

19. The lithographic projection apparatus according to claim 14, wherein the level sensor is configured to determine a height of a surface of the substrate using an optical path that includes no refractive elements.

20. A device manufacturing method, said method comprising:

projecting a patterned beam of radiation onto a target portion of a substrate; and

using at least one of an optical detection action and an optical sensing action to position the target portion in the patterned beam of radiation via an optical path that includes at least one catoptrical system.

21. The device manufacturing method according to claim 20, wherein said using at least one of an optical detection action and an optical sensing action to position the target portion includes determining a height of a surface of the substrate via the optical path that traverses at least one catoptrical system.

22. The device manufacturing method according to claim 20, wherein said projecting a patterned beam of radiation is based on the determined height.

23. The device manufacturing method according to claim 20, wherein the target portion is sensitive to radiation of the patterned beam.

24. The device manufacturing method according to claim 20, wherein said using at least one of an optical detection action and an optical sensing action is performed in a vacuum ambient.

25. The device manufacturing method according to claim 20, wherein said using at least one of an optical detection action and an optical sensing action is performed in a liquid ambient.

26. A device manufactured according to the method according to claim 20.

27. An optical analysis system comprising:

at least one of an optical detector and an optical sensor configured to determine a position of a target portion of a surface,

wherein said at least one of an optical detector and an optical sensor is configured to determine the position via an optical path that includes at least one catoptrical system.

28. A device manufacturing method, said method comprising:

projecting a patterned beam of radiation onto a target portion of a substrate; and

using a measurement system to position the target portion in the patterned beam of radiation via an optical path that includes at least one catoptrical system.

29. The device manufacturing method according to claim 28, said method further comprising calibrating the measurement system in a first ambient,

wherein said using a measurement system to position the target portion includes using the measurement system to position the target portion in a second ambient different than the first ambient.

30. The device manufacturing method according to claim 29, wherein one of the first and second ambient is a vacuum ambient.

31. The device manufacturing method according to claim 29, wherein said calibrating the measurement system includes using the measurement system to determine a height of a surface via the optical path.

32. The device manufacturing method according to claim 31, wherein said using a measurement system to position the target portion includes determining a height of the target portion via the optical path.